807-027-427-112

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Mfr.Part #
807-027-427-112
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE SGL FML 27POS 0.156
Stock
45,396
In Stock :
45,396

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Read Out :
Single
Color :
Green
Base Product Number :
807-027
Contact Finish Thickness :
-
Mounting Type :
Through Hole
Package :
Bulk
Contact Finish :
Tin
Product Status :
Active
Contact Material :
COPPER ALLOY
Mounting Style :
Panel Mount
Number of Positions :
27
Card Type :
Non Specified - Single Edge
Product :
Receptacles
Number of Positions/Bay/Row :
27
Flange Feature :
Side Mount Opening, Unthreaded, 0.128 (3.25mm) Dia
Operating Temperature :
-40°C ~ 125°C
Number of Rows :
1
Features :
-
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Material - Insulation :
Diallyl Phthalate (DAP)
Pitch :
0.156 (3.96mm)
Contact Type :
Semi Bellows
Termination :
Solder
Contact Plating :
Gold
Gender :
FEMALE
Board Thickness :
1.57 mm
Series :
807
Mounting Angle :
Vertical
Housing Material :
Diallyl Phthalate (DAP)
Datasheets
807-027-427-112
Introducing Edgeboard Connectors EDAC Inc. 807-027-427-112 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C ~ 125°C, 807-027-427-112 pinout, 807-027-427-112 datasheet PDF, 807-027-427-112 amp .Beyond Edgeboard Connectors EDAC Inc. 807-027-427-112 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 807-027-427-112


Female Green 0.156 (3.96mm) Copper Alloy 1 Rows Solder Tin 27 Positions Diallyl Phthalate (DAP)

807-027-427-112 Overview


It's recommended you mount it type Through Hole.In this case, the 807 indicates the series of the device.

807-027-427-112 Features


807 series


807-027-427-112 Applications


There are a lot of EDAC
807-027-427-112 Edgeboard Connectors applications.


  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
  • Digital Storage Oscilloscope
  • Scientific instruments.
  • Music reproduction technology
  • Communication Systems
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