77311-103-06LF
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- Mfr.Part #
- 77311-103-06LF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 6POS 2.54MM
- Stock
- 8,184
- In Stock ：
- 8,184
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- Headers, Male Pins
- Current Rating :
- 3A
- Housing Material :
- Thermoplastic
- Radiation Hardening :
- No
- Contact Finish Thickness - Post :
- 78.7μin 2.00μm
- Pitch :
- 2.54mm
- Mounting Type :
- Through Hole
- Contact Gender :
- Male
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Orientation :
- Straight
- Insulation Height :
- 0.100 2.54mm
- Connector Type :
- Header
- Contact Finish - Mating :
- Gold or Gold, GXT™
- Depth :
- 2.4mm
- Contact Length - Mating :
- 0.225 5.72mm
- Packaging :
- Bulk
- Factory Lead Time :
- 7 Weeks
- Min Operating Temperature :
- -65°C
- Voltage - Rated :
- 1.5kV
- Material Flammability Rating :
- UL94 V-0
- Termination :
- Solder
- Contact Length - Post :
- 0.200 5.08mm
- Shrouding :
- Unshrouded
- Max Voltage Rating (AC) :
- 1.5kV
- Contact Type :
- Male Pin
- Contact Material :
- Phosphor Bronze
- Contact Shape :
- Square
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Max Operating Temperature :
- 125°C
- Pitch - Mating :
- 0.100 2.54mm
- Contact Plating :
- GXT, Gold
- Number of Contacts :
- 6
- Contact Finish - Post :
- Tin
- Length :
- 15.24mm
- Number of Positions :
- 6
- Color :
- Black
- Lead Length :
- 5.09mm
- Gender :
- Male
- RoHS Status :
- RoHS Compliant
- Fastening Type :
- Push-Pull
- Mount :
- Through Hole
- Series :
- BERGSTIK®
- Mating Post Length :
- 5.72mm
- Style :
- Board to Board
- Number of Rows :
- 1
- Insulation Color :
- Black
- Insulation Material :
- Thermoplastic
- Number of Positions Loaded :
- All
- Insulation Resistance :
- 5GOhm
- Overall Contact Length :
- 0.525 13.34mm
- Housing Color :
- Black
- Datasheets
- 77311-103-06LF
BERGSTIK® Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold or Gold, GXT™ Thermoplastic 6-Position Board to Board 0.100 2.54mm Height
77311-103-06LF Overview
A Header package is included with it.Its mounting type is Through Hole.Packaging is performed using a Bulk case.It is part of the BERGSTIK® Series of products.Whenever it's below 125°C, it's best to use it.The device must operate at a temperature of -65°C at all times.Through Hole mounts the part.
77311-103-06LF Features
BERGSTIK® series
77311-103-06LF Applications
There are a lot of Amphenol ICC (FCI)
77311-103-06LF Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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