71V3556SA133BQI8

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Mfr.Part #
71V3556SA133BQI8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 165CABGA
Stock
10,545
In Stock :
10,545

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Voltage - Supply :
3.135V~3.465V
Operating Temperature :
-40°C~85°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Supplier Device Package :
165-CABGA (13x15)
Memory Type :
Volatile
RoHS Status :
Non-RoHS Compliant
Packaging :
Tape and Reel (TR)
Access Time :
4.2ns
Factory Lead Time :
12 Weeks
Clock Frequency :
133MHz
Memory Size :
4.5Mb 128K x 36
Memory Interface :
Parallel
Base Part Number :
IDT71V3556
Package / Case :
165-TBGA
Mounting Type :
Surface Mount
Datasheets
71V3556SA133BQI8
Introducing Memory Intersil (Renesas Electronics Corporation) 71V3556SA133BQI8 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Base Part Number:IDT71V3556, Package / Case:165-TBGA, Mounting Type:Surface Mount, 71V3556SA133BQI8 pinout, 71V3556SA133BQI8 datasheet PDF, 71V3556SA133BQI8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 71V3556SA133BQI8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 71V3556SA133BQI8


Memory Intersil (Renesas Electronics Corporation) 71V3556SA133BQI8 Overview

Introducing the cutting-edge IC SRAM 4.5MBIT PAR 165CABGA, meticulously crafted by Intersil, a division of Renesas Electronics Corporation. This advanced integrated circuit is engineered to revolutionize memory storage solutions, offering unparalleled performance and reliability for a diverse range of industrial applications.

Designed with precision and expertise, this SRAM module boasts a massive 4.5MBIT capacity, ensuring ample storage space for critical data in high-demand environments. Its innovative Parallel Architecture (PAR) enhances data transfer speeds, facilitating seamless integration into complex systems where speed and efficiency are paramount.

Whether powering next-generation telecommunications infrastructure, driving sophisticated medical devices, or supporting mission-critical industrial automation systems, the Memory Intersil (Renesas Electronics Corporation) 71V3556SA133BQI8 sets the benchmark for excellence in memory technology.

71V3556SA133BQI8 Features

  • High-Capacity Storage: Boasts a massive 4.5MBIT capacity, ideal for storing large volumes of critical data.
  • Parallel Architecture (PAR): Enhances data transfer speeds, ensuring seamless performance in demanding applications.
  • Robust Design: Engineered for reliability and durability in harsh industrial environments, ensuring uninterrupted operation.
  • Compact Form Factor: 165CABGA package enables easy integration into space-constrained systems, optimizing board real estate.
  • Low Power Consumption: Efficient power management extends battery life and reduces operational costs, making it ideal for portable and energy-conscious applications.

71V3556SA133BQI8 Applications

  • Telecommunications Infrastructure: Powering data routers and switches, this IC facilitates high-speed data processing and transmission in telecommunications networks, ensuring seamless connectivity for users.
  • Medical Devices: From advanced imaging equipment to patient monitoring systems, this SRAM module provides reliable data storage and retrieval, critical for maintaining patient health records and diagnostic accuracy.
  • Industrial Automation: Integrated into PLCs (Programmable Logic Controllers) and robotics systems, this IC enables real-time data processing and control, optimizing manufacturing processes and enhancing operational efficiency.
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