71V30L55TF
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- Mfr.Part #
- 71V30L55TF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 8KBIT PARALLEL 64TQFP
- Stock
- 4,135
- In Stock ：
- 4,135
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Address Bus Width :
- 20b
- RoHS Status :
- RoHS Compliant
- Package / Case :
- TQFP
- Output Characteristics :
- 3-STATE
- Lead Free :
- Contains Lead
- Length :
- 10mm
- Radiation Hardening :
- No
- Published :
- 2008
- Terminal Position :
- QUAD
- Terminal Form :
- Gull wing
- Density :
- 8 kB
- Number of Pins :
- 64
- Organization :
- 1KX8
- Thickness :
- 1.4mm
- Standby Voltage-Min :
- 3V
- ECCN Code :
- EAR99
- Sync/Async :
- ASYNCHRONOUS
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Temperature Grade :
- COMMERCIAL
- Nominal Supply Current :
- 105mA
- JESD-609 Code :
- e0
- Min Supply Voltage :
- 3V
- I/O Type :
- COMMON
- Word Size :
- 8B
- Max Operating Temperature :
- 70°C
- Factory Lead Time :
- 7 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Interface :
- Parallel
- Max Supply Voltage :
- 3.6V
- Min Operating Temperature :
- 0°C
- Pin Count :
- 64
- Memory Type :
- RAM, SDR, SRAM
- Terminal Pitch :
- 0.5mm
- Peak Reflow Temperature (Cel) :
- 240
- Width :
- 10mm
- Standby Current-Max :
- 0.003A
- Operating Supply Voltage :
- 3.3V
- Supply Voltage :
- 3.3V
- Number of Ports :
- 2
- Memory Size :
- 1kB
- Number of Terminations :
- 64
- Access Time :
- 55 ns
- Datasheets
- 71V30L55TF
Memory Intersil (Renesas Electronics Corporation) 71V30L55TF Overview
The Memory Intersil (Renesas Electronics Corporation) 71V30L55TF IC is a high-performance 8Kbit SRAM chip, housed in a compact 64TQFP package. This product is designed to meet the rigorous demands of high-speed data environments, providing robust parallel data access capabilities. Ideal for applications requiring fast access and reliable data storage, the 71V30L55TF offers an optimal solution for advanced electronic systems. Its integration facilitates improved system performance while minimizing power consumption, making it an excellent choice for developers looking to enhance their electronic product designs.
71V30L55TF Features
The 71V30L55TF SRAM features include low power consumption, high-speed operation, and a wide operating temperature range. It supports parallel interface for quick data access and manipulation. This SRAM chip is also known for its durability and reliability in various industrial conditions, ensuring consistent performance across a broad range of applications.
71V30L55TF Applications
- Telecommunication Infrastructure: Utilized in routers and switches for buffer memory, ensuring efficient data flow and minimal latency.
- Automotive Electronics: Serves as temporary data storage for advanced driver-assistance systems (ADAS), enhancing processing speed and reliability in critical driving conditions.
- Industrial Automation: Employed in control systems to manage operational data in real time, promoting enhanced decision-making and system responsiveness.
- Consumer Electronics: Integrated into devices such as digital cameras and gaming consoles, where rapid access to temporary data is crucial for high-performance functionality.
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