70V7599S133DR
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- Mfr.Part #
- 70V7599S133DR
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- PQFP
- Datasheet
- Download
- Description
- IC SRAM 4.5MBIT PARALLEL 208PQFP
- Stock
- 14,461
- In Stock ：
- 14,461
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Number of Functions :
- 1
- Number of Terminations :
- 208
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Temperature Grade :
- COMMERCIAL
- Pbfree Code :
- No
- I/O Type :
- COMMON
- Supply Voltage :
- 3.3V
- Terminal Pitch :
- 0.5mm
- Memory Type :
- RAM, SDR, SRAM
- Additional Feature :
- FLOW-THROUGH OR PIPELINED ARCHITECTURE
- RoHS Status :
- RoHS Compliant
- Package / Case :
- PQFP
- Output Characteristics :
- 3-STATE
- Max Supply Voltage :
- 3.45V
- Factory Lead Time :
- 7 Weeks
- Density :
- 4.5 Mb
- Min Supply Voltage :
- 3.15V
- Terminal Form :
- Gull wing
- Max Operating Temperature :
- 70°C
- JESD-609 Code :
- e0
- Radiation Hardening :
- No
- Min Operating Temperature :
- 0°C
- Nominal Supply Current :
- 645mA
- Memory Size :
- 512kB
- Width :
- 28mm
- Sync/Async :
- SYNCHRONOUS
- Number of Pins :
- 208
- Published :
- 2009
- Peak Reflow Temperature (Cel) :
- 225
- Standby Current-Max :
- 0.03A
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Access Time :
- 25 ns
- Lead Free :
- Contains Lead
- Number of Ports :
- 2
- Operating Supply Voltage :
- 3.3V
- Pin Count :
- 208
- Frequency :
- 133MHz
- Interface :
- Parallel
- Height Seated (Max) :
- 4.1mm
- Length :
- 28mm
- Word Size :
- 36b
- Address Bus Width :
- 34b
- Packaging :
- Bulk
- Thickness :
- 3.5mm
- Terminal Position :
- QUAD
- Datasheets
- 70V7599S133DR
Memory Intersil (Renesas Electronics Corporation) 70V7599S133DR Overview
The Memory Intersil (Renesas Electronics Corporation) 70V7599S133DR is a high-performance 4.5Mbit SRAM device encapsulated in a robust 208PQFP package. Engineered to meet the demanding requirements of advanced computing and high-speed processing applications, this SRAM integrates seamlessly into a variety of system architectures, providing an optimal solution for boosting system responsiveness and handling large workloads efficiently. Its parallel interface ensures high-speed data access and transfer, making it an excellent choice for manufacturers looking to enhance their product offerings with reliable and efficient memory components.
70V7599S133DR Features
This IC SRAM boasts several key features that make it stand out in the semiconductor industry. It operates at a lower power consumption while maintaining high data integrity and speed, suitable for sophisticated electronics that require robust performance in intensive scenarios. The 208PQFP package is designed for durable and reliable integration into hardware setups, providing stability and ease of mounting in a wide range of applications.
70V7599S133DR Applications
- Advanced Computing Systems: The high-capacity and speedy data access of the 70V7599S133DR make it ideal for use in server farms and data centers, where rapid data retrieval and storage are critical.
- Networking Hardware: Utilized in routers and switches, this SRAM enhances device throughput and efficiency, critical for managing network traffic and preventing bottlenecks.
- Telecommunications Equipment: In telecom infrastructures, the reliable and quick operation of this SRAM supports complex signal processing tasks required for modern telecommunication services.
- Industrial Automation: This memory module finds applications in automated manufacturing lines, where precision and speed are necessary to improve system responsiveness and operational efficiency.
- Aerospace and Defense: The robustness and reliability of the 70V7599S133DR are suited for aerospace applications, where systems require fail-safe operations under extreme conditions.
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