70V7319S133BFI

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Mfr.Part #
70V7319S133BFI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-LFBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 208CABGA
Stock
21,168
In Stock :
21,168

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Package / Case :
208-LFBGA
Memory Size :
4.5Mb 256K x 18
Factory Lead Time :
12 Weeks
Memory Interface :
Parallel
Memory Format :
SRAM
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Base Part Number :
IDT70V7319
Voltage - Supply :
3.15V~3.45V
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Access Time :
4.2ns
Operating Temperature :
-40°C~85°C TA
Supplier Device Package :
208-CABGA (15x15)
Memory Type :
Volatile
Clock Frequency :
133MHz
Datasheets
70V7319S133BFI
Introducing Memory Intersil (Renesas Electronics Corporation) 70V7319S133BFI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:208-LFBGA, Base Part Number:IDT70V7319, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, 70V7319S133BFI pinout, 70V7319S133BFI datasheet PDF, 70V7319S133BFI amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V7319S133BFI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V7319S133BFI


Memory Intersil (Renesas Electronics Corporation) 70V7319S133BFI Overview

The Intersil (Renesas Electronics Corporation) 70V7319S133BFI IC is a cutting-edge static random-access memory (SRAM) chip designed for high-performance applications requiring a large and rapid cache memory. This product offers a substantial 4.5Mbit of memory and leverages a parallel interface, ensuring efficient data handling and high-speed access. Packaged in a robust 208CABGA format, it is engineered for reliability and optimal thermal management, making it ideal for demanding environments. The Memory Intersil (Renesas Electronics Corporation) 70V7319S133BFI is perfect for applications where speed and data integrity are crucial, providing an essential component in the development of advanced electronics.

70V7319S133BFI Features

The 70V7319S133BFI boasts several key features that make it standout in the realm of integrated circuits. This 4.5Mbit SRAM uses a parallel communication interface to achieve high-speed data transfer rates, which is critical for systems requiring rapid access to large volumes of data. The chip's 208CABGA packaging is not only durable but also aids in efficient heat dissipation, ensuring consistent performance under thermal stress. Moreover, the device's design and architecture are optimized for low-power consumption, enhancing its suitability for power-sensitive applications.

70V7319S133BFI Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computers where quick access to a large amount of data is necessary for real-time processing and large-scale computations.
  • Networking Equipment: Applied in routers and switches to manage data flow efficiently, ensuring high-speed internet and network reliability.
  • Telecommunications: Integrated into telecommunications infrastructure to provide quick data buffering and transfer, crucial for maintaining system integrity and speed in communications.
  • Industrial Automation: Employed in control systems for industrial automation where robust memory and fast access speeds are required for complex process management and operational efficiency.
  • Aerospace and Defense: Vital in applications demanding high reliability and performance under extreme conditions, such as satellite communications and military defense systems.
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