70V7319S133BFI
- Mfr.Part #
- 70V7319S133BFI
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 208-LFBGA
- Datasheet
- Download
- Description
- IC SRAM 4.5MBIT PAR 208CABGA
- Stock
- 21,168
- In Stock :
- 21,168
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Package / Case :
- 208-LFBGA
- Memory Size :
- 4.5Mb 256K x 18
- Factory Lead Time :
- 12 Weeks
- Memory Interface :
- Parallel
- Memory Format :
- SRAM
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Base Part Number :
- IDT70V7319
- Voltage - Supply :
- 3.15V~3.45V
- Packaging :
- Tape and Reel (TR)
- Mounting Type :
- Surface Mount
- Access Time :
- 4.2ns
- Operating Temperature :
- -40°C~85°C TA
- Supplier Device Package :
- 208-CABGA (15x15)
- Memory Type :
- Volatile
- Clock Frequency :
- 133MHz
- Datasheets
- 70V7319S133BFI

Memory Intersil (Renesas Electronics Corporation) 70V7319S133BFI Overview
The Intersil (Renesas Electronics Corporation) 70V7319S133BFI IC is a cutting-edge static random-access memory (SRAM) chip designed for high-performance applications requiring a large and rapid cache memory. This product offers a substantial 4.5Mbit of memory and leverages a parallel interface, ensuring efficient data handling and high-speed access. Packaged in a robust 208CABGA format, it is engineered for reliability and optimal thermal management, making it ideal for demanding environments. The Memory Intersil (Renesas Electronics Corporation) 70V7319S133BFI is perfect for applications where speed and data integrity are crucial, providing an essential component in the development of advanced electronics.
70V7319S133BFI Features
The 70V7319S133BFI boasts several key features that make it standout in the realm of integrated circuits. This 4.5Mbit SRAM uses a parallel communication interface to achieve high-speed data transfer rates, which is critical for systems requiring rapid access to large volumes of data. The chip's 208CABGA packaging is not only durable but also aids in efficient heat dissipation, ensuring consistent performance under thermal stress. Moreover, the device's design and architecture are optimized for low-power consumption, enhancing its suitability for power-sensitive applications.
70V7319S133BFI Applications
- Advanced Computing Systems: Utilized in servers and high-performance computers where quick access to a large amount of data is necessary for real-time processing and large-scale computations.
- Networking Equipment: Applied in routers and switches to manage data flow efficiently, ensuring high-speed internet and network reliability.
- Telecommunications: Integrated into telecommunications infrastructure to provide quick data buffering and transfer, crucial for maintaining system integrity and speed in communications.
- Industrial Automation: Employed in control systems for industrial automation where robust memory and fast access speeds are required for complex process management and operational efficiency.
- Aerospace and Defense: Vital in applications demanding high reliability and performance under extreme conditions, such as satellite communications and military defense systems.
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