70V7339S166BF
- Mfr.Part #
- 70V7339S166BF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 208-LFBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 208CABGA
- Stock
- 37,110
- In Stock :
- 37,110
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Base Part Number :
- IDT70V7339
- Memory Format :
- SRAM
- Packaging :
- Tray
- Package / Case :
- 208-LFBGA
- Operating Temperature :
- 0°C~70°C TA
- Voltage - Supply :
- 3.15V~3.45V
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Memory Type :
- Volatile
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Access Time :
- 3.6ns
- Memory Interface :
- Parallel
- Memory Size :
- 9Mb 512K x 18
- Clock Frequency :
- 166MHz
- Factory Lead Time :
- 12 Weeks
- Datasheets
- 70V7339S166BF

Memory Intersil (Renesas Electronics Corporation) 70V7339S166BF Overview
The Intersil (Renesas Electronics Corporation) 70V7339S166BF SRAM IC represents a robust memory solution, designed to meet the high-speed, high-capacity demands of advanced digital systems. With a substantial 9Mbit storage capacity and a parallel interface, this IC is engineered in a 208CABGA package, ensuring compactness and durability. Its high performance and reliability make it an ideal choice for sophisticated electronics that require rapid access to large volumes of data. The incorporation of this Memory Intersil (Renesas Electronics Corporation) 70V7339S166BF component in your systems guarantees enhanced operational efficiency and improved data integrity, making it a valuable asset for B2B customers looking to upscale their technology infrastructures.
70V7339S166BF Features
This SRAM chip boasts a 9MBit capacity that is crucial for applications needing substantial memory in a compact form factor. The parallel interface facilitates quick data access and throughput, essential for high-performance computing environments. Moreover, the 208CABGA package not only minimizes the physical footprint but also enhances the thermal stability and reliability of the integrated circuit.
70V7339S166BF Applications
- Advanced Computing Systems: Utilized in server farms and data centers where speed and capacity are critical for large-scale data processing and storage.
- Networking Equipment: Essential for routers, switches, and other networking hardware requiring high-speed memory for buffering and data packet manipulation.
- Telecommunications: Supports telecommunications infrastructure by providing high-speed, reliable memory for signal processing applications.
- Industrial Automation: Applied in complex industrial automation systems where quick access to large volumes of data is necessary for real-time control and processing.
- Consumer Electronics: Used in high-end consumer electronics such as gaming consoles and smart TVs, enhancing user experience through improved performance and reliability.
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