67997-472HLF
- Mfr.Part #
- 67997-472HLF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 72POS 2.54MM
- Stock
- 33,442
- In Stock :
- 33,442
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- Headers, Male Pins
- Contact Gender :
- Male
- Termination :
- Solder
- Length :
- 91.44mm
- Material Flammability Rating :
- UL94 V-0
- Lead Length :
- 3.05mm
- Min Operating Temperature :
- -65°C
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Shrouding :
- Unshrouded
- Contact Plating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Material :
- Phosphor Bronze
- Insulation Color :
- Black
- Contact Finish - Mating :
- Tin
- Housing Color :
- Black
- Housing Material :
- Thermoplastic
- REACH SVHC :
- No SVHC
- RoHS Status :
- RoHS Compliant
- Factory Lead Time :
- 8 Weeks
- Style :
- Board to Board
- Lead Free :
- Lead Free
- Overall Contact Length :
- 0.450 11.43mm
- Number of Rows :
- 2
- Mount :
- Through Hole
- Orientation :
- Straight
- Pitch :
- 2.54mm
- Gender :
- Male
- Current Rating :
- 3A
- Width :
- 4.83mm
- Insulation Resistance :
- 5GOhm
- Number of Positions Loaded :
- All
- Insulation Height :
- 0.100 2.54mm
- Series :
- BERGSTIK® II
- Packaging :
- Bulk
- Mating Post Length :
- 5.84mm
- Number of Contacts :
- 72
- Voltage - Rated :
- 1.5kV
- Max Operating Temperature :
- 125°C
- Contact Shape :
- Square
- Contact Finish Thickness - Mating :
- 100.0μin 2.54μm
- Contact Type :
- Male Pin
- Contact Length - Post :
- 0.120 3.05mm
- Number of Positions :
- 72
- Depth :
- 4.83mm
- Fastening Type :
- Push-Pull
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Connector Type :
- Header
- Contact Length - Mating :
- 0.230 5.84mm
- Pitch - Mating :
- 0.100 2.54mm
- Max Voltage Rating (AC) :
- 1.5kV
- Mounting Type :
- Through Hole
- Color :
- Black
- Datasheets
- 67997-472HLF

BERGSTIK® II Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Tin 72-Position Board to Board 0.100 2.54mm Height
67997-472HLF Overview
The packaging contains Header.There is a Through Hole mounting type for the device.This product is packaged in a case marked Bulk.Product number BERGSTIK® II belongs to the BERGSTIK® II Series.Whenever the temperature is below 125°C, it's best.There is a minimum temperature requirement of [0°C] for this device.There is a Through Hole mount on the part.
67997-472HLF Features
BERGSTIK® II series
67997-472HLF Applications
There are a lot of Amphenol ICC (FCI)
67997-472HLF Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















