66AK2L06XCMSA

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Mfr.Part #
66AK2L06XCMSA
Manufacturer
Texas Instruments
Package / Case
900-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC MULTICORE DSP+ARM 900BGA
Stock
15,996
In Stock :
15,996

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
RoHS Status :
ROHS3 Compliant
Package / Case :
900-BFBGA, FCBGA
Contact Plating :
Copper, Silver, Tin
Operating Temperature :
-40°C~100°C TC
Number of Pins :
900
Base Part Number :
66AK2L06
Lead Free :
Lead Free
Length :
25mm
Non-Volatile Memory :
ROM (384kB)
On Chip Data RAM :
5.384MB
Series :
66AK2Lx KeyStone Multicore
Thickness :
2.98mm
Voltage - Core :
Variable
Frequency :
1GHz
Data Bus Width :
32b
Mounting Type :
Surface Mount
Type :
DSP+ARM®
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RAM Size :
1Mb
Width :
25mm
Mount :
Surface Mount
Interface :
EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
Voltage - I/O :
0.85V 1.0V 1.8V 3.3V
Number of UART Channels :
4
Packaging :
Tray
Factory Lead Time :
12 Weeks
Lifecycle Status :
ACTIVE (Last Updated: 1 week ago)
Datasheets
66AK2L06XCMSA
Introducing DSP (Digital Signal Processors) Texas Instruments 66AK2L06XCMSA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BFBGA, FCBGA, Operating Temperature:-40°C~100°C TC, Number of Pins:900, Base Part Number:66AK2L06, Mounting Type:Surface Mount, Type:DSP+ARM®, 66AK2L06XCMSA pinout, 66AK2L06XCMSA datasheet PDF, 66AK2L06XCMSA amp .Beyond DSP (Digital Signal Processors) Texas Instruments 66AK2L06XCMSA ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments 66AK2L06XCMSA


DSP Texas Instruments 66AK2L06XCMSA Overview

The DSP Texas Instruments 66AK2L06XCMSA represents a state-of-the-art integrated circuit that blends the power of multicore DSPs with ARM cores, all encapsulated in a 900BGA package. This IC is tailored for advanced applications requiring high-speed data processing and efficient task management. It leverages the robustness of Texas Instruments' technology, ensuring reliability and superior performance. With its advanced architecture, the 66AK2L06XCMSA is designed to meet the rigorous demands of modern embedded systems, making it an ideal choice for developers and engineers seeking to innovate and scale their solutions efficiently.

66AK2L06XCMSA Features

The 66AK2L06XCMSA IC offers a blend of features that make it a powerful component for numerous demanding applications. It combines multicore DSP capabilities with ARM Cortex-A15 cores, providing a versatile platform for both high-speed digital signal processing and general-purpose computing. The device supports high-level data throughput and efficient power management, which are essential for sustained performance in complex environments. Additionally, its 900BGA packaging allows for optimal heat dispersion and space utilization in compact system designs.

66AK2L06XCMSA Applications

  • Telecommunications Equipment: Utilizes its DSP capabilities for signal processing and data management tasks in network routers and switches, enhancing bandwidth and reducing latency.
  • Advanced Industrial Control Systems: Employs both the ARM and DSP cores to handle complex computational tasks in real-time control systems, improving operational efficiency and reliability.
  • Medical Imaging Systems: Leverages high-speed signal processing to support the demands of medical imaging equipment such as MRI and ultrasound machines, facilitating faster and more accurate imaging.
  • Automotive: Suitable for advanced driver-assistance systems (ADAS) where quick processing of sensory data is critical for safety and performance.
  • Aerospace and Defense: Used in systems requiring robust signal processing capabilities for radar, sonar, and other electronic warfare systems.
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