66AK2H06BXAAW2
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- Mfr.Part #
- 66AK2H06BXAAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC 1517FCBGA
- Stock
- 8,304
- In Stock ：
- 8,304
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Lead Free :
- Lead Free
- Width :
- 40mm
- Terminal Form :
- Ball
- Height :
- 3.75mm
- Non-Volatile Memory :
- ROM (384kB)
- On Chip Data RAM :
- 8.375MB
- Number of UART Channels :
- 2
- Low Power Mode :
- yes
- Integrated Cache :
- yes
- Number of Pins :
- 1517
- Series :
- 66AK2Hx KeyStone Multicore
- Operating Temperature :
- 0°C~85°C TC
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-609 Code :
- e1
- RoHS Status :
- ROHS3 Compliant
- Length :
- 40mm
- Package / Case :
- 1517-BBGA, FCBGA
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Voltage - Core :
- Variable
- Mounting Type :
- Surface Mount
- Core Architecture :
- ARM
- RAM Size :
- 6MB
- Supply Voltage :
- 1V
- Base Part Number :
- 66AK2H06
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Frequency :
- 1.2GHz
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Max Supply Voltage :
- 1.1V
- Data Bus Width :
- 32b
- Format :
- Floating Point
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 245
- Contact Plating :
- Copper, Silver, Tin
- Min Supply Voltage :
- 800mV
- Boundary Scan :
- yes
- Memory Size :
- 4MB
- Terminal Pitch :
- 1mm
- Type :
- DSP+ARM®
- Number of Cores :
- 6
- Terminal Position :
- BOTTOM
- Datasheets
- 66AK2H06BXAAW2
DSP Texas Instruments 66AK2H06BXAAW2 Overview
The DSP Texas Instruments 66AK2H06BXAAW2 integrates advanced digital signal processing and ARM core technologies into a high-performance system-on-chip (SoC) solution, catering to the demanding requirements of both signal processing and system control. This IC is designed to deliver exceptional computational power and energy efficiency, making it ideal for applications requiring robust processing capabilities in a compact form factor. Its 1517-pin FCBGA (Flip-Chip Ball Grid Array) packaging ensures a reliable connection and heat dissipation, vital for maintaining performance in high-demand environments. The DSP Texas Instruments 66AK2H06BXAAW2 is a prime choice for developers seeking to enhance system performance with cutting-edge technology.
66AK2H06BXAAW2 Features
This IC boasts a dual-core architecture, combining the power of DSP and ARM processors. This hybrid setup enables high-speed data processing alongside efficient task management and system control. Enhanced with multiple connectivity options and built-in security features, the 66AK2H06BXAAW2 supports a broad range of peripherals and interfaces, making it highly versatile for integrated solutions. Its features include extensive I/O capabilities, robust security protocols, and advanced multimedia support, aligning it with the latest technological standards for industrial, automotive, and networked systems.
66AK2H06BXAAW2 Applications
- Telecommunications: Utilized in base stations and network processors, where its DSP capabilities enable efficient signal processing and management of high-speed data transfers.
- Industrial Automation: Powers complex automation systems, providing the computational ability to handle control algorithms and real-time data processing for machinery and robotic systems.
- Medical Imaging: Applied in medical devices for imaging like MRI and ultrasound equipment, where its high-performance processing is crucial for fast and accurate image reconstruction.
- Automotive: Used in advanced driver-assistance systems (ADAS), contributing to real-time vehicle monitoring, sensor data processing, and decision-making support.
- Consumer Electronics: Integrates into devices such as high-definition audio/video equipment, enhancing media processing capabilities to deliver superior user experiences.
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