5SGSMD4E3H29I3L
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- Mfr.Part #
- 5SGSMD4E3H29I3L
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 780HBGA
- Stock
- 37,070
- In Stock ：
- 37,070
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 0.82V~0.88V
- RoHS Status :
- RoHS Compliant
- Factory Lead Time :
- 8 Weeks
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Number of Terminations :
- 780
- Packaging :
- Tray
- Base Part Number :
- 5SGSMD4
- JESD-30 Code :
- S-PBGA-B780
- Number of Inputs :
- 360
- Length :
- 33mm
- Surface Mount :
- yes
- Terminal Form :
- Ball
- Supply Voltage :
- 0.85V
- Series :
- Stratix® V GS
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Number of Outputs :
- 360
- Height Seated (Max) :
- 3.6mm
- Number of Logic Elements/Cells :
- 360000
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Organization :
- 13584 CLBS
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Number of LABs/CLBs :
- 135840
- Width :
- 33mm
- Operating Temperature :
- -40°C~100°C TJ
- Total RAM Bits :
- 19456000
- Number of I/O :
- 360
- Package / Case :
- 780-BBGA, FCBGA
- Datasheets
- 5SGSMD4E3H29I3L
FPGAs Altera (Intel) 5SGSMD4E3H29I3L Overview
The FPGAs Altera (Intel) 5SGSMD4E3H29I3L is an advanced integrated circuit designed to meet the demanding needs of modern digital applications. Manufactured by Intel, formerly known as Altera, this FPGA leverages state-of-the-art technology to provide high performance, flexibility, and efficiency. The 5SGSMD4E3H29I3L model is housed in a 780HBGA package, which ensures robustness and reliable connectivity. With 360 configurable I/O pins, it offers extensive versatility for a wide range of applications, making it an excellent choice for designers looking to push the boundaries of technology in their projects.
5SGSMD4E3H29I3L Features
This FPGA features a high-density design that supports complex logic functions and high-speed signal processing. The device is designed for optimal power efficiency, which minimizes power consumption while maintaining performance. It is also compatible with multiple design software tools, simplifying the development process and enabling rapid prototyping and deployment. The 780HBGA package not only provides a compact footprint but also enhances the thermal management capabilities of the device.
5SGSMD4E3H29I3L Applications
- Data Centers: Utilized in server infrastructure to handle complex computations and data processing tasks efficiently.
- Telecommunications: Integral for the infrastructure of telecommunication networks, supporting the processing needs for high-speed data transmission and reception.
- Automotive: Applied in automotive systems for advanced driver-assistance systems (ADAS) and infotainment systems, enhancing both safety and user experience.
- Industrial Automation: Used in control systems for manufacturing lines, improving precision and reliability in automated tasks.
- Aerospace and Defense: Critical for applications requiring high levels of reliability and performance under harsh conditions, such as satellite communications and avionics.
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