5SGSMD4E1H29C2N

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Mfr.Part #
5SGSMD4E1H29C2N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
5,484
In Stock :
5,484

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
33mm
Number of LABs/CLBs :
135840
Voltage - Supply :
0.87V~0.93V
RoHS Status :
RoHS Compliant
Terminal Pitch :
1mm
Supply Voltage :
0.9V
Surface Mount :
yes
Power Supplies :
0.851.52.52.5/31.2/3V
Packaging :
Tray
Operating Temperature :
0°C~85°C TJ
Width :
33mm
Number of I/O :
360
Mounting Type :
Surface Mount
Number of Terminations :
780
Base Part Number :
5SGSMD4
Organization :
13584 CLBS
Terminal Position :
BOTTOM
Qualification Status :
Not Qualified
Height Seated (Max) :
3.6mm
Number of Outputs :
360
Factory Lead Time :
8 Weeks
Series :
Stratix® V GS
Total RAM Bits :
19456000
Number of Logic Elements/Cells :
360000
Terminal Form :
Ball
Package / Case :
780-BBGA, FCBGA
Number of Inputs :
360
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B780
Datasheets
5SGSMD4E1H29C2N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD4E1H29C2N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Number of Terminations:780, Base Part Number:5SGSMD4, Package / Case:780-BBGA, FCBGA, 5SGSMD4E1H29C2N pinout, 5SGSMD4E1H29C2N datasheet PDF, 5SGSMD4E1H29C2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD4E1H29C2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD4E1H29C2N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD4E1H29C2N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD4E1H29C2N is a highly advanced integrated circuit designed for versatile applications requiring high-speed digital processing and flexible hardware configuration. This FPGA from Intel's Altera series offers a substantial logic density and a rich feature set, making it ideal for accelerating complex algorithms and integrating multiple functions in a single chip. Its 780-ball high-bandwidth ball grid array (HBGA) package ensures robust physical connectivity and excellent thermal performance, suitable for high-demand environments.

5SGSMD4E1H29C2N Features

This IC FPGA features 360 input/output pins that provide ample connectivity for interfacing with other modules and external devices. Its configuration is optimized for efficiency, supporting rapid prototyping and large-scale integration in sophisticated digital systems. The device is built on Intel's advanced technology, offering reliability and high performance necessary for modern electronic applications.

5SGSMD4E1H29C2N Applications

  • Data Centers: Utilized in server infrastructure to accelerate data processing and improve bandwidth efficiency. The high I/O count and configurability make it suitable for managing multiple data streams and complex processing tasks.
  • Telecommunications: Essential in the development of telecommunications equipment, where it supports high-speed signal processing, interface conversion, and protocol adaptation.
  • Automotive: Applied in automotive safety and control systems, offering the necessary processing power and connectivity to handle multiple sensor inputs and drive critical decision-making processes in real time.
  • Medical Devices: Used in medical imaging systems, where its ability to process complex algorithms rapidly helps in delivering real-time imaging and diagnostics.
  • Industrial Automation: Ideal for control systems in industrial automation, where robustness and the ability to perform multiple control tasks simultaneously are paramount.
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