5SGSMD3H3F35C2N

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Mfr.Part #
5SGSMD3H3F35C2N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 432 I/O 1152FBGA
Stock
32,591
In Stock :
32,591

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
5SGSMD3
JESD-30 Code :
S-PBGA-B1152
Factory Lead Time :
8 Weeks
Peak Reflow Temperature (Cel) :
245
Power Supplies :
0.851.52.52.5/31.2/3V
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
13312000
Packaging :
Tray
JESD-609 Code :
e1
Qualification Status :
Not Qualified
Package / Case :
1152-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
HTS Code :
8542.39.00.01
Number of Logic Elements/Cells :
236000
Length :
35mm
Organization :
8900 CLBS
RoHS Status :
RoHS Compliant
Number of LABs/CLBs :
89000
Number of Outputs :
432
Height Seated (Max) :
3.6mm
Terminal Form :
Ball
Series :
Stratix® V GS
Time@Peak Reflow Temperature-Max (s) :
30
Voltage - Supply :
0.87V~0.93V
Surface Mount :
yes
Mounting Type :
Surface Mount
ECCN Code :
3A001.A.7.A
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
432
Number of Inputs :
432
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Width :
35mm
Supply Voltage :
0.9V
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3H3F35C2N from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:5SGSMD3, Operating Temperature:0°C~85°C TJ, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, 5SGSMD3H3F35C2N pinout, 5SGSMD3H3F35C2N datasheet PDF, 5SGSMD3H3F35C2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3H3F35C2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3H3F35C2N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3H3F35C2N Overview

The Altera (Intel) 5SGSMD3H3F35C2N represents a sophisticated blend of speed and flexibility within the realm of field-programmable gate arrays (FPGAs). Designed to cater to the demanding needs of high-speed communications and real-time processing applications, this FPGA excels in scenarios requiring rapid data throughput and high-level signal management. As an integral part of Intel's renowned FPGA product line, the 5SGSMD3H3F35C2N is engineered to support complex digital systems with its ample logic elements, substantial I/O capacity, and robust memory interface, making it an ideal choice for designers aiming to accelerate product development while maintaining scalability and system reliability.

5SGSMD3H3F35C2N Features

  • High I/O Count: Equipped with 432 I/O pins, this FPGA offers extensive interfacing capabilities.
  • Dense Packaging: The 1152FBGA package allows for a compact form factor while hosting a large number of programmable logic resources.
  • Versatility: Configurable for a variety of digital and mixed-signal applications, from basic logic gates to complex system-on-chip integrations.

5SGSMD3H3F35C2N Applications

  • Data Centers: Used in server infrastructure to manage data flow and signal processing, enhancing operational efficiency and speed.
  • Telecommunications: Integral in communication equipment for signal processing and data transmission, ensuring high-speed data exchange and reliability.
  • Automotive Electronics: Serves as a critical component in advanced driver-assistance systems (ADAS), providing the necessary computing power to process real-time data from vehicle sensors.
  • Industrial Automation: Employs in control systems for real-time machine decision making, improving precision and productivity in complex industrial settings.
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