5SGSMD3H1F35C2L

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Mfr.Part #
5SGSMD3H1F35C2L
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 432 I/O 1152FBGA
Stock
27,907
In Stock :
27,907

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
JESD-30 Code :
S-PBGA-B1152
Operating Temperature :
0°C~85°C TJ
Width :
35mm
Number of Inputs :
432
Height Seated (Max) :
3.6mm
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
1152-BBGA, FCBGA
Qualification Status :
Not Qualified
Number of I/O :
432
Number of LABs/CLBs :
89000
Packaging :
Tray
RoHS Status :
RoHS Compliant
Base Part Number :
5SGSMD3
Factory Lead Time :
8 Weeks
Voltage - Supply :
0.82V~0.88V
Total RAM Bits :
13312000
Number of Outputs :
432
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
35mm
Power Supplies :
0.851.52.52.5/31.2/3V
Supply Voltage :
0.85V
Number of Logic Elements/Cells :
236000
Organization :
8900 CLBS
Mounting Type :
Surface Mount
Terminal Form :
Ball
Terminal Pitch :
1mm
Series :
Stratix® V GS
Datasheets
5SGSMD3H1F35C2L
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3H1F35C2L from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:1152-BBGA, FCBGA, Base Part Number:5SGSMD3, Mounting Type:Surface Mount, 5SGSMD3H1F35C2L pinout, 5SGSMD3H1F35C2L datasheet PDF, 5SGSMD3H1F35C2L amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3H1F35C2L ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3H1F35C2L


FPGAs Altera (Intel) 5SGSMD3H1F35C2L Overview

The FPGAs Altera (Intel) 5SGSMD3H1F35C2L represents a pinnacle of flexibility and performance in the field of integrated circuits. Designed by Altera, now part of Intel, this FPGA leverages advanced technology to cater to demanding computational needs. The product encapsulates high-level integration capabilities within its 1152FBGA package, making it ideal for developers aiming to accelerate their hardware efficiency. Offering a substantial array of 432 I/O options, it supports a wide range of applications from complex digital processing to high-speed signal interfacing, ensuring adaptability in both prototyping and end-product deployments. Its robust design is specifically tailored to minimize latency and maximize throughput, providing an optimal solution for high-performance tasks.

5SGSMD3H1F35C2L Features

This FPGA module excels in providing extensive features that enhance its applicability across various high-tech industries. Key features include a dense array of 432 user I/O ports, high-speed transceiver rates, and a large logic density that allows for extensive programmability and customization. Additionally, its integration with Intel's technology offers superior power efficiency and the ability to handle complex algorithms and data processes.

5SGSMD3H1F35C2L Applications

  • Data Centers: Ideal for managing intensive data-processing workloads, improving data throughput and reducing latency in server applications.
  • Telecommunications: Can be employed to enhance signal processing capabilities, such as for baseband processing and network routers, ensuring faster and more reliable data transmission.
  • Automotive: Suitable for use in driver assistance systems, where rapid data processing is crucial for real-time decision making and system responsiveness.
  • Medical Imaging: Helps in the acceleration of high-resolution medical imaging systems, facilitating quicker image processing and enhanced diagnostic capabilities.
  • Industrial Automation: Plays a critical role in the automation of manufacturing processes, providing the computational power needed to optimize robotics and control systems.
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