5SGSMD3E3H29I3LN

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Mfr.Part #
5SGSMD3E3H29I3LN
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
14,479
In Stock :
14,479

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Number of Logic Elements/Cells :
236000
Factory Lead Time :
8 Weeks
Base Part Number :
5SGSMD3
Number of Inputs :
360
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Organization :
8900 CLBS
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Length :
33mm
Operating Temperature :
-40°C~100°C TJ
Voltage - Supply :
0.82V~0.88V
Terminal Form :
Ball
Supply Voltage :
0.85V
Surface Mount :
yes
JESD-30 Code :
S-PBGA-B780
RoHS Status :
RoHS Compliant
Height Seated (Max) :
3.6mm
Series :
Stratix® V GS
Number of Outputs :
360
Number of I/O :
360
Power Supplies :
0.851.52.52.5/31.2/3V
Terminal Position :
BOTTOM
Package / Case :
780-BBGA, FCBGA
Number of Terminations :
780
Mounting Type :
Surface Mount
Number of LABs/CLBs :
89000
Width :
33mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Total RAM Bits :
13312000
Datasheets
5SGSMD3E3H29I3LN
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29I3LN from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:5SGSMD3, Operating Temperature:-40°C~100°C TJ, Package / Case:780-BBGA, FCBGA, Number of Terminations:780, Mounting Type:Surface Mount, 5SGSMD3E3H29I3LN pinout, 5SGSMD3E3H29I3LN datasheet PDF, 5SGSMD3E3H29I3LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29I3LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E3H29I3LN


FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29I3LN Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29I3LN is a highly advanced integrated circuit designed for versatility and peak performance in complex digital computations. Engineered by Altera, now part of Intel, this FPGA stands out for its high I/O pin count and robust packaging, making it ideal for sophisticated applications that require high-speed data processing and flexible logic implementation. Its 780-pin HBGA (Heat-Spread Ball Grid Array) package ensures reliable thermal management and connectivity, positioning it as a top choice for developers and engineers aiming to push the boundaries of digital innovation.

5SGSMD3E3H29I3LN Features

This FPGA model boasts 360 programmable I/O ports, allowing for extensive customization and scalability in hardware design. Its integration within the 780HBGA package enhances its ability to manage heat effectively, ensuring stable performance under various operational conditions. The device supports a wide range of logic density configurations, which can significantly streamline development cycles and enhance system reliability.

5SGSMD3E3H29I3LN Applications

  • Data Centers: Utilized for accelerating compute-intensive applications such as data processing and storage management, improving efficiency and speed.
  • Telecommunications: Essential in the development of high-speed communication protocols and network equipment, enhancing bandwidth and reducing latency.
  • Automotive Technology: Integrates into advanced driver-assistance systems (ADAS) to process real-time sensory data and support critical functions.
  • Medical Devices: Employed in medical imaging systems, such as MRI and ultrasound devices, for processing complex visual data and supporting diagnostics.
  • Industrial Automation: Drives automation systems for increased productivity and safety in manufacturing environments.
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