5SGSMD3E3H29C2LN

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Mfr.Part #
5SGSMD3E3H29C2LN
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
47,392
In Stock :
47,392

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
236000
Series :
Stratix® V GS
Qualification Status :
Not Qualified
Operating Temperature :
0°C~85°C TJ
Organization :
8900 CLBS
Supply Voltage :
0.85V
Width :
33mm
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Number of LABs/CLBs :
89000
Number of Outputs :
360
Factory Lead Time :
8 Weeks
Number of Inputs :
360
Length :
33mm
Terminal Pitch :
1mm
Base Part Number :
5SGSMD3
Total RAM Bits :
13312000
Package / Case :
780-BBGA, FCBGA
Height Seated (Max) :
3.6mm
Voltage - Supply :
0.82V~0.88V
JESD-30 Code :
S-PBGA-B780
Number of Terminations :
780
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Number of I/O :
360
Power Supplies :
0.851.52.52.5/31.2/3V
Terminal Position :
BOTTOM
Datasheets
5SGSMD3E3H29C2LN
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29C2LN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:5SGSMD3, Package / Case:780-BBGA, FCBGA, Number of Terminations:780, 5SGSMD3E3H29C2LN pinout, 5SGSMD3E3H29C2LN datasheet PDF, 5SGSMD3E3H29C2LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29C2LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E3H29C2LN


FPGAs Altera (Intel) 5SGSMD3E3H29C2LN Overview

The FPGAs Altera (Intel) 5SGSMD3E3H29C2LN is a high-performance integrated circuit designed for flexibility and efficiency across a range of applications. Manufactured by Altera, now part of Intel, this FPGA features a 780-pin HBGA package and supports a vast array of I/O options with 360 available I/O pins. Its architecture is tailored to support rapid prototyping and scalable solutions, making it an indispensable tool for developers looking to push the boundaries of hardware acceleration and complex algorithm implementations in real-world scenarios.

5SGSMD3E3H29C2LN Features

This model boasts a dense logic capacity, which is critical for handling complex designs and multi-function applications simultaneously. The FPGA facilitates improved system performance with its ability to be reprogrammed on the fly, offering a versatile set-up for dynamic application fields. With advanced security features and power efficiency, the 5SGSMD3E3H29C2LN stands out as a reliable choice for developers aiming at next-generation electronic applications.

5SGSMD3E3H29C2LN Applications

  • Telecommunications Infrastructure

    Adapts seamlessly to the demanding and evolving needs of telecommunications technology, aiding in the development of routers, switches, and complex signal processing equipment.

  • Data Center Solutions

    Improves data throughput and efficiency in server farms and cloud storage facilities, optimizing space and power consumption while boosting processing capabilities.

  • Automotive Technology

    Enhances the reliability and performance of automotive applications, from advanced driver-assistance systems (ADAS) to infotainment and beyond.

  • Industrial Automation

    Drives innovation in automated manufacturing processes, offering robust control and customization options to handle complex industrial tasks with precision.

  • Medical Devices

    Empowers medical device innovation with its ability to support complex, real-time data processing for imaging systems and diagnostic instruments.

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