5SGSMD3E2H29I3N

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Mfr.Part #
5SGSMD3E2H29I3N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
37,484
In Stock :
37,484

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
-40°C~100°C TJ
Height Seated (Max) :
3.6mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Organization :
8900 CLBS
Base Part Number :
5SGSMD3
Terminal Position :
BOTTOM
Number of LABs/CLBs :
89000
Supply Voltage :
0.85V
Number of Inputs :
360
Total RAM Bits :
13312000
RoHS Status :
RoHS Compliant
Packaging :
Tray
Voltage - Supply :
0.82V~0.88V
Number of I/O :
360
Number of Terminations :
780
Mounting Type :
Surface Mount
Number of Outputs :
360
Number of Logic Elements/Cells :
236000
Power Supplies :
0.851.52.52.5/31.2/3V
Qualification Status :
Not Qualified
Package / Case :
780-BBGA, FCBGA
Width :
33mm
Series :
Stratix® V GS
Surface Mount :
yes
Factory Lead Time :
8 Weeks
Length :
33mm
Terminal Pitch :
1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
JESD-30 Code :
S-PBGA-B780
Datasheets
5SGSMD3E2H29I3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E2H29I3N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:5SGSMD3, Number of Terminations:780, Mounting Type:Surface Mount, Package / Case:780-BBGA, FCBGA, 5SGSMD3E2H29I3N pinout, 5SGSMD3E2H29I3N datasheet PDF, 5SGSMD3E2H29I3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E2H29I3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E2H29I3N


FPGAs Altera 5SGSMD3E2H29I3N Overview

Introducing the highly versatile and powerful FPGas Altera 5SGSMD3E2H29I3N, a premium field-programmable gate array (FPGA) developed by Altera, now part of Intel. This advanced IC FPGA model is designed to cater to high-performance applications that demand reliability, speed, and flexibility. Featuring 360 input/output pins and packaged in a 780-ball BGA (ball grid array), this FPGA is engineered to support complex digital systems with reduced latency and increased data throughput. The integration of this FPGA into your systems ensures scalability and can significantly enhance the processing capabilities of your application infrastructure.

5SGSMD3E2H29I3N Features

This FPGA from Altera offers several standout features that make it a competitive choice for a variety of demanding applications. Its large number of I/Os and high-density ball grid array packaging allow for a robust interface with other components, essential for complex, multi-layered digital systems. Additionally, the device supports various advanced features that are critical for modern digital applications, including high-speed transceiver data rates and ample logic density for resource-intensive tasks.

5SGSMD3E2H29I3N Applications

  • Telecommunications: This FPGA can be implemented in networking equipment, facilitating the processing and routing of data with high efficiency and lower power consumption, essential for modern telecommunications infrastructure.
  • Data Centers: In data centers, the 5SGSMD3E2H29I3N can accelerate data processing tasks, manage large-scale data operations, and support high-speed server communications, crucial for cloud computing services and large-scale storage systems.
  • Industrial Automation: Industrial automation systems benefit from the high I/O count and the flexibility of FPGAs like the 5SGSMD3E2H29I3N, which can be programmed to handle diverse control and processing tasks in manufacturing and robotics.
  • Aerospace and Defense: The robustness and programmability of this FPGA make it suitable for applications in aerospace and defense, where reliability and the capacity to perform in harsh environments are necessary.
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