5SGSMD3E2H29I3N
- Mfr.Part #
- 5SGSMD3E2H29I3N
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 780HBGA
- Stock
- 37,484
- In Stock :
- 37,484
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- -40°C~100°C TJ
- Height Seated (Max) :
- 3.6mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Organization :
- 8900 CLBS
- Base Part Number :
- 5SGSMD3
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 89000
- Supply Voltage :
- 0.85V
- Number of Inputs :
- 360
- Total RAM Bits :
- 13312000
- RoHS Status :
- RoHS Compliant
- Packaging :
- Tray
- Voltage - Supply :
- 0.82V~0.88V
- Number of I/O :
- 360
- Number of Terminations :
- 780
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 360
- Number of Logic Elements/Cells :
- 236000
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Qualification Status :
- Not Qualified
- Package / Case :
- 780-BBGA, FCBGA
- Width :
- 33mm
- Series :
- Stratix® V GS
- Surface Mount :
- yes
- Factory Lead Time :
- 8 Weeks
- Length :
- 33mm
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B780
- Datasheets
- 5SGSMD3E2H29I3N

FPGAs Altera 5SGSMD3E2H29I3N Overview
Introducing the highly versatile and powerful FPGas Altera 5SGSMD3E2H29I3N, a premium field-programmable gate array (FPGA) developed by Altera, now part of Intel. This advanced IC FPGA model is designed to cater to high-performance applications that demand reliability, speed, and flexibility. Featuring 360 input/output pins and packaged in a 780-ball BGA (ball grid array), this FPGA is engineered to support complex digital systems with reduced latency and increased data throughput. The integration of this FPGA into your systems ensures scalability and can significantly enhance the processing capabilities of your application infrastructure.
5SGSMD3E2H29I3N Features
This FPGA from Altera offers several standout features that make it a competitive choice for a variety of demanding applications. Its large number of I/Os and high-density ball grid array packaging allow for a robust interface with other components, essential for complex, multi-layered digital systems. Additionally, the device supports various advanced features that are critical for modern digital applications, including high-speed transceiver data rates and ample logic density for resource-intensive tasks.
5SGSMD3E2H29I3N Applications
- Telecommunications: This FPGA can be implemented in networking equipment, facilitating the processing and routing of data with high efficiency and lower power consumption, essential for modern telecommunications infrastructure.
- Data Centers: In data centers, the 5SGSMD3E2H29I3N can accelerate data processing tasks, manage large-scale data operations, and support high-speed server communications, crucial for cloud computing services and large-scale storage systems.
- Industrial Automation: Industrial automation systems benefit from the high I/O count and the flexibility of FPGAs like the 5SGSMD3E2H29I3N, which can be programmed to handle diverse control and processing tasks in manufacturing and robotics.
- Aerospace and Defense: The robustness and programmability of this FPGA make it suitable for applications in aerospace and defense, where reliability and the capacity to perform in harsh environments are necessary.
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