5SGSMD3E1H29I2N

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Mfr.Part #
5SGSMD3E1H29I2N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
5,082
In Stock :
5,082

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
3.6mm
Factory Lead Time :
8 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
89000
Total RAM Bits :
13312000
Number of Logic Elements/Cells :
236000
Number of Inputs :
360
Width :
33mm
Voltage - Supply :
0.87V~0.93V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-30 Code :
S-PBGA-B780
Organization :
8900 CLBS
HTS Code :
8542.39.00.01
Packaging :
Tray
Power Supplies :
0.91.52.52.5/31.2/3V
Supply Voltage :
0.9V
Length :
33mm
Operating Temperature :
-40°C~100°C TJ
Number of I/O :
360
Package / Case :
780-BBGA, FCBGA
Terminal Form :
Ball
Qualification Status :
Not Qualified
Number of Outputs :
360
RoHS Status :
RoHS Compliant
Terminal Pitch :
1mm
Series :
Stratix® V GS
Surface Mount :
yes
Number of Terminations :
780
Mounting Type :
Surface Mount
Base Part Number :
5SGSMD3
Terminal Position :
BOTTOM
Datasheets
5SGSMD3E1H29I2N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E1H29I2N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:780-BBGA, FCBGA, Number of Terminations:780, Mounting Type:Surface Mount, Base Part Number:5SGSMD3, 5SGSMD3E1H29I2N pinout, 5SGSMD3E1H29I2N datasheet PDF, 5SGSMD3E1H29I2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E1H29I2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E1H29I2N


FPGAs Altera 5SGSMD3E1H29I2N Overview

Introducing the FPGAs Altera 5SGSMD3E1H29I2N, a high-performance integrated circuit developed by Altera (now part of Intel). This field-programmable gate array (FPGA) is designed to meet the demanding needs of modern digital applications. With its robust 780-pin HBGA package, this FPGA facilitates complex, high-speed digital processing and offers a versatile solution for designers seeking flexible hardware configurations. Its integration capabilities and extensive I/O options make it an excellent choice for applications requiring high levels of data manipulation and processing power.

5SGSMD3E1H29I2N Features

The 5SGSMD3E1H29I2N FPGA offers a plethora of features that cater to advanced system requirements. It supports up to 360 I/O pins, allowing extensive connectivity and interface options. Its 780HBGA package ensures robust physical integration in a compact form factor, making it ideal for dense circuit designs. Additionally, the device is optimized for low power consumption while maintaining high performance, ensuring efficiency in high-speed computing environments.

5SGSMD3E1H29I2N Applications

  • Telecommunications Equipment: Utilized in routers, switches, and other network infrastructure to enhance signal processing capabilities and manage large volumes of data efficiently.
  • Data Center Solutions: Plays a critical role in data storage and processing applications, enabling high-speed data transfer and reliable operations under extensive workloads.
  • Automotive Technology: Integrated into driver assistance systems, providing necessary processing power for real-time decision making and sensor data analysis.
  • Industrial Automation: Used in control systems to facilitate real-time processing and management of complex operations in manufacturing environments.
  • Consumer Electronics: Forms the backbone of high-performance computing devices such as gaming consoles and smart TVs, supporting enhanced graphics and user interfaces.
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