5SGSMD3E1H29C2N
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- Mfr.Part #
- 5SGSMD3E1H29C2N
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 780HBGA
- Stock
- 8,284
- In Stock ：
- 8,284
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 360
- Organization :
- 8900 CLBS
- Base Part Number :
- 5SGSMD3
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Package / Case :
- 780-BBGA, FCBGA
- Total RAM Bits :
- 13312000
- Number of Terminations :
- 780
- Length :
- 33mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 33mm
- Number of I/O :
- 360
- Number of Logic Elements/Cells :
- 236000
- Terminal Position :
- BOTTOM
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Operating Temperature :
- 0°C~85°C TJ
- Supply Voltage :
- 0.9V
- Packaging :
- Tray
- Series :
- Stratix® V GS
- Factory Lead Time :
- 8 Weeks
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- S-PBGA-B780
- RoHS Status :
- RoHS Compliant
- Height Seated (Max) :
- 3.6mm
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 89000
- Voltage - Supply :
- 0.87V~0.93V
- Number of Inputs :
- 360
- Surface Mount :
- yes
- Datasheets
- 5SGSMD3E1H29C2N
FPGAs Altera 5SGSMD3E1H29C2N Overview
The FPGAs Altera 5SGSMD3E1H29C2N by Intel is a high-performance integrated circuit designed to meet the complex computational needs of modern digital systems. This FPGA leverages advanced technology to provide a versatile platform capable of executing multiple operations in parallel, enhancing system efficiency and performance. The device features a dense 780-pin ball grid array (BGA) package that ensures robust electrical connectivity and superior performance in a compact form factor. Ideal for designers looking to push the boundaries of technology in power-sensitive applications, the 5SGSMD3E1H29C2N offers a flexible solution adaptable to a multitude of high-speed digital processing tasks.
5SGSMD3E1H29C2N Features
This integrated circuit boasts 360 user I/Os, allowing for extensive peripheral connectivity and data throughput, essential for applications requiring high levels of data exchange and interfacing. The BGA packaging not only ensures a reliable physical connection but also aids in efficient heat dissipation, critical in maintaining optimal operational temperatures and enhancing device reliability and longevity.
5SGSMD3E1H29C2N Applications
- Telecommunications: The 5SGSMD3E1H29C2N can be integrated into network routers and switches, facilitating the management and routing of data across complex network infrastructures. Its high I/O count supports extensive connectivity options required in these high-speed data environments.
- Data Centers: This FPGA is ideal for data processing hardware, where it accelerates complex computations and supports the rapid transfer of data across server farms. Its ability to handle simultaneous tasks makes it suitable for the parallel processing demands of modern data centers.
- Industrial Automation: In industrial settings, the 5SGSMD3E1H29C2N drives automation equipment, providing the processing power needed for real-time control systems and intricate robotic mechanisms. The robustness of its package ensures reliability in harsh environments.
- Aerospace and Defense: Due to its programmable nature and high reliability, the FPGA serves crucial roles in aerospace and defense systems, including radar and signal processing applications. It supports the critical, high-availability demands of these applications while offering the flexibility to adapt to new challenges and requirements.
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