5SGSMD3E1H29C2L
- Mfr.Part #
- 5SGSMD3E1H29C2L
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 780HBGA
- Stock
- 25,357
- In Stock :
- 25,357
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 0.82V~0.88V
- Package / Case :
- 780-BBGA, FCBGA
- Number of Inputs :
- 360
- Packaging :
- Tray
- Organization :
- 8900 CLBS
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 89000
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Number of Logic Elements/Cells :
- 236000
- Series :
- Stratix® V GS
- Total RAM Bits :
- 13312000
- Length :
- 33mm
- Number of Outputs :
- 360
- Surface Mount :
- yes
- Number of I/O :
- 360
- RoHS Status :
- RoHS Compliant
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Factory Lead Time :
- 8 Weeks
- Number of Terminations :
- 780
- Width :
- 33mm
- Supply Voltage :
- 0.85V
- JESD-30 Code :
- S-PBGA-B780
- HTS Code :
- 8542.39.00.01
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 3.6mm
- Base Part Number :
- 5SGSMD3
- Datasheets
- 5SGSMD3E1H29C2L

FPGAs Altera 5SGSMD3E1H29C2L Overview
The FPGAs Altera 5SGSMD3E1H29C2L by Intel represents a significant leap forward in field-programmable gate array technology. Designed to meet the high-performance needs of modern digital applications, this FPGA integrates advanced features within its 780-pin HBGA package, offering exceptional I/O capabilities and versatility. This product is ideal for designers aiming to accelerate their R&D process with a reliable, high-speed FPGA solution that provides substantial logic density and connectivity options.
5SGSMD3E1H29C2L Features
- High I/O Count: Equipped with 360 programmable I/O pins, allowing for flexible interfacing with a wide range of peripherals and systems.
- Dense Logic Capability: Provides robust support for complex digital computations and data processing tasks within a compact form factor.
- Advanced Package: Utilizes a 780-pin HBGA package that supports enhanced thermal management and reduced signal interference, fostering more reliable operation.
5SGSMD3E1H29C2L Applications
- Telecommunications: This FPGA is used in developing infrastructure for 5G networks, improving the speed and reliability of data transmission.
- Automotive: Integral in the design of automotive safety and navigation systems, providing the necessary processing power and connectivity.
- Industrial Automation: Enhances control systems and operational efficiency in complex industrial environments through high-speed, reliable data processing.
- Consumer Electronics: Drives the innovation in consumer electronics, such as smart home devices, offering both flexibility and high performance in signal processing.
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