5SGSMD3E1H29C2L

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Mfr.Part #
5SGSMD3E1H29C2L
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
25,357
In Stock :
25,357

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
0.82V~0.88V
Package / Case :
780-BBGA, FCBGA
Number of Inputs :
360
Packaging :
Tray
Organization :
8900 CLBS
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Qualification Status :
Not Qualified
Number of LABs/CLBs :
89000
Power Supplies :
0.851.52.52.5/31.2/3V
Number of Logic Elements/Cells :
236000
Series :
Stratix® V GS
Total RAM Bits :
13312000
Length :
33mm
Number of Outputs :
360
Surface Mount :
yes
Number of I/O :
360
RoHS Status :
RoHS Compliant
Terminal Pitch :
1mm
Terminal Form :
Ball
Factory Lead Time :
8 Weeks
Number of Terminations :
780
Width :
33mm
Supply Voltage :
0.85V
JESD-30 Code :
S-PBGA-B780
HTS Code :
8542.39.00.01
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
3.6mm
Base Part Number :
5SGSMD3
Datasheets
5SGSMD3E1H29C2L
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E1H29C2L from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:780, Operating Temperature:0°C~85°C TJ, Base Part Number:5SGSMD3, 5SGSMD3E1H29C2L pinout, 5SGSMD3E1H29C2L datasheet PDF, 5SGSMD3E1H29C2L amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E1H29C2L ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E1H29C2L


FPGAs Altera 5SGSMD3E1H29C2L Overview

The FPGAs Altera 5SGSMD3E1H29C2L by Intel represents a significant leap forward in field-programmable gate array technology. Designed to meet the high-performance needs of modern digital applications, this FPGA integrates advanced features within its 780-pin HBGA package, offering exceptional I/O capabilities and versatility. This product is ideal for designers aiming to accelerate their R&D process with a reliable, high-speed FPGA solution that provides substantial logic density and connectivity options.

5SGSMD3E1H29C2L Features

  • High I/O Count: Equipped with 360 programmable I/O pins, allowing for flexible interfacing with a wide range of peripherals and systems.
  • Dense Logic Capability: Provides robust support for complex digital computations and data processing tasks within a compact form factor.
  • Advanced Package: Utilizes a 780-pin HBGA package that supports enhanced thermal management and reduced signal interference, fostering more reliable operation.

5SGSMD3E1H29C2L Applications

  • Telecommunications: This FPGA is used in developing infrastructure for 5G networks, improving the speed and reliability of data transmission.
  • Automotive: Integral in the design of automotive safety and navigation systems, providing the necessary processing power and connectivity.
  • Industrial Automation: Enhances control systems and operational efficiency in complex industrial environments through high-speed, reliable data processing.
  • Consumer Electronics: Drives the innovation in consumer electronics, such as smart home devices, offering both flexibility and high performance in signal processing.
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