5CGTFD9D5F27I7N

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Mfr.Part #
5CGTFD9D5F27I7N
Manufacturer
Altera (Intel)
Package / Case
672-BGA
Datasheet
Download
Description
IC FPGA 336 I/O 672FBGA
Stock
426
In Stock :
426

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
336
Operating Temperature :
-40°C~100°C TJ
Length :
27mm
Supply Voltage :
1.1V
Package / Case :
672-BGA
Total RAM Bits :
14251008
Surface Mount :
yes
Terminal Position :
BOTTOM
Height Seated (Max) :
2mm
Number of Terminations :
672
Number of LABs/CLBs :
113560
Number of Logic Elements/Cells :
301000
JESD-609 Code :
e1
Width :
27mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code :
8542.39.00.01
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
Cyclone® V GT
Number of I/O :
336
Base Part Number :
5CGTFD9
Packaging :
Tray
Power Supplies :
1.11.2/3.32.5V
Qualification Status :
Not Qualified
Number of Inputs :
336
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
1.07V~1.13V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B672
Terminal Pitch :
1mm
Factory Lead Time :
8 Weeks
Datasheets
5CGTFD9D5F27I7N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5CGTFD9D5F27I7N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:672-BGA, Number of Terminations:672, Base Part Number:5CGTFD9, Mounting Type:Surface Mount, 5CGTFD9D5F27I7N pinout, 5CGTFD9D5F27I7N datasheet PDF, 5CGTFD9D5F27I7N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5CGTFD9D5F27I7N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5CGTFD9D5F27I7N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5CGTFD9D5F27I7N Overview

Introducing the FPGAs (Field Programmable Gate Array) Altera (Intel) 5CGTFD9D5F27I7N, a high-performance, field-programmable gate array designed by Altera, now part of Intel. This FPGA stands out in the market due to its integration capabilities and versatile functionality. Engineered to cater to a high level of digital processing needs, this device features 336 input/output pins and is packaged in a compact 672FBGA format, making it ideal for dense board configurations. The 5CGTFD9D5F27I7N FPGA is optimized for applications that require rapid prototyping and extensive adaptability in both commercial and industrial environments.

5CGTFD9D5F27I7N Features

This FPGA offers a robust platform for developing complex digital applications. It supports high-speed transceiver data rates and advanced digital signal processing. The 336 I/Os provide ample connectivity for multiple peripherals, ensuring efficient communication and processing capabilities. Furthermore, its 672-pin fine-pitch ball grid array (FBGA) package ensures a minimized footprint on system boards, which is crucial for modern, space-constrained designs.

5CGTFD9D5F27I7N Applications

  • Telecommunications: Utilized in routing and switching technology, enabling rapid data flow and enhanced signal integrity in network hardware.
  • Data Centers: Helps manage the intensive computation and storage demands, contributing to increased efficiency and reliability in server farm operations.
  • Automotive Electronics: Applied in driver assistance systems, providing the necessary processing power for real-time vehicle monitoring and control.
  • Industrial Automation: Employs in control systems, improving operational accuracy and speed in manufacturing processes.
  • Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems, ensuring smooth graphics rendering and high-speed data processing.
This HTML content is structured to cater to B2B clients by providing a professional, informative overview of the FPGA, highlighting its features, and delineating its applications in various industries, helping them to understand potential uses and integration benefits.
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