54101-T3003LF
- Mfr.Part #
- 54101-T3003LF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 3POS 2.54MM
- Stock
- 376,000
- In Stock :
- 376,000
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- Headers, Male Pins
- Radiation Hardening :
- No
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mounting Type :
- Through Hole
- Material Flammability Rating :
- UL94 V-0
- Insulation Height :
- 0.100 2.54mm
- RoHS Status :
- RoHS Compliant
- Color :
- Black
- Contact Gender :
- Male
- Housing Color :
- Black
- Max Voltage Rating (AC) :
- 1.5kV
- Contact Finish Thickness - Post :
- 100.0μin 2.54μm
- Gender :
- Male
- Shrouding :
- Unshrouded
- Style :
- Board to Board
- Contact Shape :
- Square
- Housing Material :
- Thermoplastic
- Contact Length - Post :
- 0.120 3.05mm
- Contact Length - Mating :
- 0.318 8.08mm
- Current Rating :
- 3A
- Fastening Type :
- Push-Pull
- Mating Post Length :
- 8.08mm
- Packaging :
- Bulk
- Contact Finish - Mating :
- Tin
- Pitch :
- 2.54mm
- Length :
- 7.62mm
- Number of Contacts :
- 3
- Orientation :
- Straight
- Max Operating Temperature :
- 125°C
- Insulation Resistance :
- 5GOhm
- Connector Type :
- Header
- Contact Type :
- Male Pin
- Contact Finish Thickness - Mating :
- 100.0μin 2.54μm
- Pitch - Mating :
- 0.100 2.54mm
- Voltage - Rated :
- 1.5kV
- Min Operating Temperature :
- -65°C
- Lead Length :
- 3.05mm
- Insulation Color :
- Black
- Termination :
- Solder
- Contact Plating :
- Tin
- Depth :
- 2.41mm
- Flammability Rating :
- UL94 V-0
- Overall Contact Length :
- 0.538 13.67mm
- Number of Rows :
- 1
- Number of Positions :
- 3
- Contact Finish - Post :
- Tin
- Factory Lead Time :
- 8 Weeks
- Contact Material :
- Phosphor Bronze
- Mount :
- Through Hole
- Number of Positions Loaded :
- All
- Series :
- BERGSTIK®
- Datasheets
- 54101-T3003LF

BERGSTIK® Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Tin 3-Position Board to Board 0.100 2.54mm Height
54101-T3003LF Overview
Currently, it is packaged in Header.The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the BERGSTIK® Series, it belongs to the range of products of that series.A temperature below 125°C is best for using it.The device must run at -65°C degrees.Through Hole represents the mounting point for the part.
54101-T3003LF Features
BERGSTIK® series
54101-T3003LF Applications
There are a lot of Amphenol ICC (FCI)
54101-T3003LF Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















