532944-1
- Mfr.Part #
- 532944-1
- Manufacturer
- TE Connectivity AMP Connectors
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER HD 516POS PCB
- Stock
- 30,802
- In Stock :
- 30,802
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- Manufacturer :
- TE Connectivity AMP Connectors
- Product Category :
- Specialized
- Number of Rows :
- 4
- Contact Finish Thickness :
- 30.0μin 0.76μm
- Total Number of Contacts :
- 516
- Contact Finish :
- Gold
- Pitch :
- 0.100 2.54mm
- Mixed Contacts :
- No
- Filter Feature :
- No
- Flammability Rating :
- UL94 V-0
- Packaging :
- Tube
- Color :
- Natural
- Connector Style :
- High Density (HDC, HDI, HPC)
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- DIN Conformance :
- No
- Mating Information :
- MULTIPLE MATING PARTS AVAILABLE
- Option :
- GENERAL PURPOSE
- IEC Conformance :
- No
- Feature :
- Mating Guide
- Number of Positions Loaded :
- All
- MIL Conformance :
- No
- Mount :
- Through Hole
- Lead Pitch :
- 2.54mm
- Connector Type :
- Header, Male Pins
- Series :
- HDI (High Density Interconnect)
- Reach Compliance Code :
- Unknown
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- -65°C~125°C
- Published :
- 1997
- Number of Positions :
- 516
- Material Flammability Rating :
- UL94 V-0
- Mounting Type :
- Through Hole
- Termination :
- Solder
- Datasheets
- 532944-1
HDI (High Density Interconnect) Series Header, Male Pins Solder Gold Natural 30.0μin 0.76μm 516 Positions Pitch: 0.100 2.54mm -65°C~125°C Tube Through Hole
532944-1 Overview
It comes in Header, Male Pins packaging.The device's mounting type is Through Hole.In order to package the product, a Tube case is used.It belongs to the HDI (High Density Interconnect) Series of products.Its Mating Guide feature renders it more powerful in many ways.The part is mounted by Through Hole.The device runs in -65°C~125°C Operating Temperature.
532944-1 Features
HDI (High Density Interconnect) series
532944-1 Applications
There are a lot of TE Connectivity AMP Connectors
532944-1 Backplane Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
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