532931-3
- Mfr.Part #
- 532931-3
- Manufacturer
- TE Connectivity AMP Connectors
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER HD 276POS PCB
- Stock
- 36,502
- In Stock :
- 36,502
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- Manufacturer :
- TE Connectivity AMP Connectors
- Product Category :
- Specialized
- Length - Termination :
- 0.19 inch
- Total Number of Contacts :
- 276
- Operating Temperature :
- -65°C~125°C
- Contact Finish Thickness :
- 30.0μin 0.76μm
- Mating Contact Row Spacing :
- 0.1 inch
- Series :
- HDI (High Density Interconnect)
- Contact Finish :
- Gold
- Body Depth :
- 0.462 inch
- PCB Contact Row Spacing :
- 2.54 mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Reliability :
- COMMERCIAL
- Reference Standard :
- UL, CSA
- Number of Positions Loaded :
- All
- RoHS Status :
- Non-RoHS Compliant
- PCB Contact Pattern :
- RECTANGULAR
- Polarization Key :
- POLARIZED KEY
- Number Of PCB Rows :
- 3
- Mounting Type :
- Through Hole
- Contact Pattern :
- RECTANGULAR
- Connector Style :
- High Density (HDC, HDI, HPC)
- Body Breadth :
- 0.48 inch
- Contact Material :
- Phosphor Bronze
- Termination :
- Solder
- Material Flammability Rating :
- UL94 V-0
- Body/Shell Style :
- Receptacle
- Body Length or Diameter :
- 10.25 inch
- Durability :
- 250 Cycles
- Feature :
- Mating Guide
- Connector Type :
- Header, Male Pins
- Packaging :
- Tube
- Reach Compliance Code :
- Unknown
- Flammability Rating :
- UL94 V-0
- Pitch :
- 0.100 2.54mm
- Number of Rows :
- 3
- Number of Positions :
- 276
- Mount :
- Through Hole
- Color :
- Natural
- Number of Conductors :
- ONE
- Published :
- 1997
- Contact Style :
- SQ PIN-SKT
- Insulation Material :
- GLASS FILLED POLYPHENYLENE SULPHIDE
- Datasheets
- 532931-3
HDI (High Density Interconnect) Series Header, Male Pins Solder Gold Natural 30.0μin 0.76μm 276 Positions Pitch: 0.100 2.54mm -65°C~125°C Tube Through Hole
532931-3 Overview
The product comes in a package of Header, Male Pins.Through Hole is the type of mounting for the device.To package the product, a Tube case is used.The product is a member of the HDI (High Density Interconnect) Series.It is more powerful in many ways due to its Mating Guide feature.It is mounted by Through Hole.It operates at an operating temperature of -65°C~125°C.
532931-3 Features
HDI (High Density Interconnect) series
532931-3 Applications
There are a lot of TE Connectivity AMP Connectors
532931-3 Backplane Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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