5013311307
- Mfr.Part #
- 5013311307
- Manufacturer
- Molex
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 13POS 1MM
- Stock
- 2,200
- In Stock :
- 2,200
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- Manufacturer :
- Molex
- Product Category :
- Headers, Male Pins
- Contact Finish Thickness - Mating :
- 40.0μin 1.02μm
- Insulation Color :
- Natural
- Factory Lead Time :
- 12 Weeks
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tape and Reel (TR)
- Series :
- Pico-Clasp 501331
- Contact Material :
- Phosphor Bronze
- Connector Type :
- Header
- Number of Rows :
- 1
- Mounting Type :
- Surface Mount
- Pitch - Mating :
- 0.039 1.00mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Material Flammability Rating :
- UL94 V-0
- Contact Finish - Mating :
- Tin
- Contact Shape :
- Square
- Published :
- 2010
- Insulation Height :
- 0.213 5.40mm
- Number of Positions :
- 13
- Insulation Material :
- Polyamide (PA46), Nylon 4/6
- Fastening Type :
- Latch Holder
- Termination :
- Solder
- Shrouding :
- Shrouded - 4 Wall
- Contact Type :
- Male Pin
- Applications :
- GENERAL PURPOSE
- Number of Positions Loaded :
- All
- Feature :
- Pick and Place, Solder Retention
- Style :
- Board to Cable/Wire
- Datasheets
- 5013311307
Pico-Clasp 501331 Series 1-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Tin Polyamide (PA46), Nylon 4/6 13-Position Board to Cable/Wire 0.213 5.40mm Height
5013311307 Overview
Packaging is Header.Surface Mount is the mounting type.Packaging for the product is carried out via a Tape & Reel (TR) case.As a product of the Pico-Clasp 501331 Series, it can be found in this category.A possible application of the device would be General Purpose.With its Pick and Place, Solder Retention feature, it is more powerful in many ways.
5013311307 Features
Pico-Clasp 501331 series
5013311307 Applications
There are a lot of Molex
5013311307 Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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