23A512-E/ST

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Mfr.Part #
23A512-E/ST
Manufacturer
Microchip Technology
Package / Case
8-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC SRAM 512KBIT SPI/QUAD 8TSSOP
Stock
21,803
In Stock :
21,803

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Manufacturer :
Microchip Technology
Product Category :
Memory
Series :
--
JESD-30 Code :
R-PDSO-G8
Voltage - Supply :
1.7V~2.2V
Memory Type :
Volatile
Reach Compliance Code :
Compliant
Operating Mode :
SYNCHRONOUS
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Factory Lead Time :
20 Weeks
Mounting Style :
SMD/SMT
Memory Width :
8
Terminal Position :
Dual
Temperature Grade :
Automotive
Length :
4.4mm
RoHS Status :
ROHS3 Compliant
Memory Organization :
64K x 8
Base Product Number :
23A512
Screening Level :
TS 16949
Product Status :
Active
Supplier Device Package :
8-TSSOP
Number of Functions :
1
Subcategory :
Memory and Data Storage
Number of Pins :
8
Manufacturer :
Microchip
Memory IC Type :
STANDARD SRAM
Minimum Operating Temperature :
- 40 C
Parallel/Serial :
Serial
Write Cycle Time - Word, Page :
--
Interface Type :
SDI, SPI, SQI
Published :
2012
Memory Density :
524288 bit
Memory Interface :
SPI - Quad I/O
Packaging :
Tube
Supply Voltage-Max (Vsup) :
2.2V
Seated Height-Max :
1.2 mm
Brand :
Microchip Technology
Memory Size :
512Kb 64K x 8
Width :
3mm
Clock Frequency :
16MHz
Terminal Form :
Gull wing
Product Category :
SRAM
Supply Voltage-Min (Vsup) :
1.7V
Operating Temperature :
-40°C~85°C TA
Terminal Pitch :
0.65mm
Number of Terminations :
8
Terminal Finish :
Matte Tin (Sn) - annealed
Access Time :
32 ns
Memory Format :
SRAM
Package / Case :
8-TSSOP (0.173, 4.40mm Width)
Package :
Tube
Number of Terminals :
8
Type :
SYNCHRONOUS
Peak Reflow Temperature (Cel) :
260
Mounting Type :
Surface Mount
Maximum Operating Temperature :
+ 125 C
Base Part Number :
23A512
Organization :
64 k x 8
Product Type :
SRAM
JESD-609 Code :
e3
RoHS :
Details
Time@Peak Reflow Temperature-Max (s) :
40
Package Shape :
RECTANGULAR
Height Seated (Max) :
1.2mm
Number of Words :
65536 words
Datasheets
23A512-E/ST
Introducing Memory Microchip Technology 23A512-E/ST from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:8, Operating Temperature:-40°C~85°C TA, Number of Terminations:8, Package / Case:8-TSSOP (0.173, 4.40mm Width), Type:SYNCHRONOUS, Mounting Type:Surface Mount, Base Part Number:23A512, 23A512-E/ST pinout, 23A512-E/ST datasheet PDF, 23A512-E/ST amp .Beyond Memory Microchip Technology 23A512-E/ST ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology 23A512-E/ST


Memory Microchip Technology 23A512-E/ST Overview

Unlocking the potential of high-performance digital systems, the Memory Microchip Technology 23A512-E/ST stands out as a pivotal component for modern electronic designs. This Integrated Circuit (IC) from Microchip Technology is a 512-Kbit Serial SRAM with SPI (Serial Peripheral Interface) and QUAD interface capabilities, packed efficiently into an 8-TSSOP (Thin Shrink Small Outline Package). Its high-speed data access and low-power consumption make it an excellent choice for applications requiring quick data manipulation and storage without compromising on power efficiency. By integrating this IC into your designs, you're ensuring reliability and scalability, all while maintaining Microchip's commitment to performance that can satisfy the fast-paced demands of contemporary technology.

23A512-E/ST Features

  • Capacity: 512 Kbits of serial SRAM storage
  • Interface: SPI/QUAD for flexible and fast communication
  • Package: 8-TSSOP for a compact footprint
  • Low Power Consumption: Ideal for power-sensitive applications
  • Manufacturer: Trusted quality and support from Microchip Technology

23A512-E/ST Applications

  • Industrial Control Systems: Serves as additional high-speed memory for temporary data logging and inter-processor communication.
  • Consumer Electronics: Improves the responsiveness of multimedia devices by offering quick access to buffer memory.
  • Automotive Electronics: Provides reliable data storage for advanced driver-assistance systems (ADAS) that require fast data retrieval.
  • Internet of Things (IoT) Devices: Enables efficient data caching for seamless user experiences in smart home applications.
  • Wearable Technology: Supports the compact size and low power requirements of modern wearable devices with its efficient design.
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