23A512-E/ST

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Mfr.Part #
23A512-E/ST
Manufacturer
Microchip Technology
Package / Case
8-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC SRAM 512KBIT SPI/QUAD 8TSSOP
Stock
21,803
In Stock :
21,803

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Manufacturer :
Microchip Technology
Product Category :
Memory
Brand :
Microchip Technology
Memory IC Type :
STANDARD SRAM
Subcategory :
Memory and Data Storage
Memory Width :
8
Organization :
64 k x 8
Product Status :
Active
Mounting Type :
Surface Mount
Memory Interface :
SPI - Quad I/O
Operating Mode :
SYNCHRONOUS
Parallel/Serial :
Serial
Clock Frequency :
16MHz
Number of Terminals :
8
Published :
2012
Peak Reflow Temperature (Cel) :
260
Number of Words :
65536 words
Write Cycle Time - Word, Page :
--
RoHS :
Details
Memory Type :
Volatile
Access Time :
32 ns
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Supplier Device Package :
8-TSSOP
Memory Organization :
64K x 8
Height Seated (Max) :
1.2mm
Operating Temperature :
-40°C~85°C TA
Width :
3mm
Memory Format :
SRAM
Series :
--
Factory Lead Time :
20 Weeks
Terminal Pitch :
0.65mm
Temperature Grade :
Automotive
Interface Type :
SDI, SPI, SQI
Supply Voltage-Max (Vsup) :
2.2V
Mounting Style :
SMD/SMT
Memory Size :
512Kb 64K x 8
Number of Terminations :
8
Screening Level :
TS 16949
Seated Height-Max :
1.2 mm
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
1.7V~2.2V
Memory Density :
524288 bit
Supply Voltage-Min (Vsup) :
1.7V
Number of Pins :
8
Surface Mount :
yes
Package Shape :
RECTANGULAR
Packaging :
Tube
Terminal Finish :
Matte Tin (Sn) - annealed
Base Part Number :
23A512
Time@Peak Reflow Temperature-Max (s) :
40
Manufacturer :
Microchip
Terminal Position :
Dual
Base Product Number :
23A512
Number of Functions :
1
Minimum Operating Temperature :
- 40 C
Product Category :
SRAM
JESD-30 Code :
R-PDSO-G8
Length :
4.4mm
Maximum Operating Temperature :
+ 125 C
JESD-609 Code :
e3
Terminal Form :
Gull wing
Package :
Tube
Package / Case :
8-TSSOP (0.173, 4.40mm Width)
Product Type :
SRAM
Type :
SYNCHRONOUS
Reach Compliance Code :
Compliant
Datasheets
23A512-E/ST
Introducing Memory Microchip Technology 23A512-E/ST from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Number of Terminations:8, Number of Pins:8, Base Part Number:23A512, Package / Case:8-TSSOP (0.173, 4.40mm Width), Type:SYNCHRONOUS, 23A512-E/ST pinout, 23A512-E/ST datasheet PDF, 23A512-E/ST amp .Beyond Memory Microchip Technology 23A512-E/ST ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology 23A512-E/ST


Memory Microchip Technology 23A512-E/ST Overview

Unlocking the potential of high-performance digital systems, the Memory Microchip Technology 23A512-E/ST stands out as a pivotal component for modern electronic designs. This Integrated Circuit (IC) from Microchip Technology is a 512-Kbit Serial SRAM with SPI (Serial Peripheral Interface) and QUAD interface capabilities, packed efficiently into an 8-TSSOP (Thin Shrink Small Outline Package). Its high-speed data access and low-power consumption make it an excellent choice for applications requiring quick data manipulation and storage without compromising on power efficiency. By integrating this IC into your designs, you're ensuring reliability and scalability, all while maintaining Microchip's commitment to performance that can satisfy the fast-paced demands of contemporary technology.

23A512-E/ST Features

  • Capacity: 512 Kbits of serial SRAM storage
  • Interface: SPI/QUAD for flexible and fast communication
  • Package: 8-TSSOP for a compact footprint
  • Low Power Consumption: Ideal for power-sensitive applications
  • Manufacturer: Trusted quality and support from Microchip Technology

23A512-E/ST Applications

  • Industrial Control Systems: Serves as additional high-speed memory for temporary data logging and inter-processor communication.
  • Consumer Electronics: Improves the responsiveness of multimedia devices by offering quick access to buffer memory.
  • Automotive Electronics: Provides reliable data storage for advanced driver-assistance systems (ADAS) that require fast data retrieval.
  • Internet of Things (IoT) Devices: Enables efficient data caching for seamless user experiences in smart home applications.
  • Wearable Technology: Supports the compact size and low power requirements of modern wearable devices with its efficient design.
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