2211-2X10G00S-2.6-2.8B
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- Mfr.Part #
- 2211-2X10G00S-2.6-2.8B
- Manufacturer
- Oupiin
- Package / Case
- Datasheet
- Download
- Description
- PIN HEADER, DOUBLE ROW, 20 PIN,
- Stock
- 1
- In Stock ：
- 1
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- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Oupiin
- Product Category :
- Headers, Male Pins
- Insulation Color :
- Black
- Contact Finish - Mating :
- Gold
- Pitch - Mating :
- 0.100 (2.54mm)
- Number of Positions :
- 20
- Insulation Height :
- 0.067 (1.70mm)
- Termination :
- Solder
- Features :
- -
- Package :
- Bulk
- Contact Finish Thickness - Post :
- Flash
- Fastening Type :
- Push-Pull
- Number of Positions Loaded :
- All
- Material Flammability Rating :
- UL94 V-0
- Shrouding :
- Unshrouded
- Contact Finish - Post :
- Gold
- Contact Length - Post :
- 0.102 (2.60mm)
- Current Rating (Amps) :
- 1A
- Overall Contact Length :
- 0.280 (7.10mm)
- Mated Stacking Heights :
- -
- Connector Type :
- Header
- Contact Type :
- Male Pin
- Operating Temperature :
- -40°C ~ 105°C
- Style :
- Board to Board
- Series :
- 2211
- Mounting Type :
- Through Hole
- Product Status :
- Active
- Voltage Rating :
- -
- Contact Material :
- Brass
- Number of Rows :
- 2
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Base Product Number :
- 2211
- Contact Length - Mating :
- 0.110 (2.80mm)
- Applications :
- -
- Insulation Material :
- Polyamide (PA6T), Nylon 6T
- Ingress Protection :
- -
- Contact Finish Thickness - Mating :
- Flash
- Contact Shape :
- Square
- Datasheets
- 2211-2X10G00S-2.6-2.8B
2211 Series 2-Row Header Solder Brass Through Hole Gold Polyamide (PA6T), Nylon 6T 20-Position Board to Board 0.067 (1.70mm) Height
2211-2X10G00S-2.6-2.8B Overview
This product is packaged in a Header cartonThis device's mounting type is Through Hole.2211 Series product.- is one possible application.Running in -40°C ~ 105°C Operating Temperature.
2211-2X10G00S-2.6-2.8B Features
2211 series
2211-2X10G00S-2.6-2.8B Applications
There are a lot of Oupiin
2211-2X10G00S-2.6-2.8B Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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