2011-2X08TSB
- Mfr.Part #
- 2011-2X08TSB
- Manufacturer
- Oupiin
- Package / Case
- Datasheet
- Download
- Description
- PIN HEADER, DOUBLE ROW, 16 PIN,
- Stock
- 34,208
- In Stock :
- 34,208
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- Manufacturer :
- Oupiin
- Product Category :
- Headers, Male Pins
- Insulation Color :
- Black
- Operating Temperature :
- -40°C ~ 105°C
- Applications :
- -
- Style :
- Board to Board
- Termination :
- Solder
- Current Rating (Amps) :
- 3A
- Pitch - Mating :
- 0.100 (2.54mm)
- Insulation Height :
- 0.098 (2.50mm)
- Features :
- -
- Product Status :
- Active
- Series :
- 2011
- Contact Length - Post :
- 0.118 (3.00mm)
- Insulation Material :
- Polybutylene Terephthalate (PBT)
- Ingress Protection :
- -
- Base Product Number :
- 2011
- Number of Positions Loaded :
- All
- Contact Finish - Mating :
- Tin
- Material Flammability Rating :
- UL94 V-0
- Contact Finish Thickness - Mating :
- -
- Shrouding :
- Unshrouded
- Contact Type :
- Male Pin
- Number of Positions :
- 16
- Contact Finish Thickness - Post :
- -
- Contact Finish - Post :
- Tin
- Mated Stacking Heights :
- -
- Mounting Type :
- Through Hole
- Overall Contact Length :
- 0.457 (11.60mm)
- Fastening Type :
- Push-Pull
- Package :
- Bulk
- Contact Shape :
- Square
- Number of Rows :
- 2
- Contact Length - Mating :
- 0.240 (6.10mm)
- Connector Type :
- Header
- Voltage Rating :
- -
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Contact Material :
- Brass
- Datasheets
- 2011-2X08TSB

2011 Series 2-Row Header Solder Brass Through Hole Tin Polybutylene Terephthalate (PBT) 16-Position Board to Board 0.098 (2.50mm) Height
2011-2X08TSB Overview
Currently, it is packaged in Header.The mounting type of the device is Through Hole.A product of the 2011 Series, it belongs to the range of products of that series.This device may be used for the purpose of -.-40°C ~ 105°C Operating Temperature is the default operating temperature for the device.
2011-2X08TSB Features
2011 series
2011-2X08TSB Applications
There are a lot of Oupiin
2011-2X08TSB Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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