2011-2X03G00SD025B
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- Mfr.Part #
- 2011-2X03G00SD025B
- Manufacturer
- Oupiin
- Package / Case
- Datasheet
- Download
- Description
- PIN HEADER, DOUBLE ROW, 3 PIN, S
- Stock
- 304
- In Stock ：
- 304
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- Manufacturer :
- Oupiin
- Product Category :
- Headers, Male Pins
- Contact Length - Post :
- 0.118 (3.00mm)
- Operating Temperature :
- -40°C ~ 105°C
- Product Status :
- Active
- Number of Positions Loaded :
- All
- Package :
- Bulk
- Contact Finish Thickness - Mating :
- Flash
- Number of Rows :
- 2
- Insulation Color :
- Black
- Features :
- -
- Overall Contact Length :
- 0.457 (11.60mm)
- Style :
- Board to Board
- Contact Shape :
- Square
- Base Product Number :
- 2011
- Ingress Protection :
- -
- Termination :
- Solder
- Mounting Type :
- Through Hole
- Applications :
- -
- Contact Finish - Mating :
- Gold
- Pitch - Mating :
- 0.100 (2.54mm)
- Current Rating (Amps) :
- 3A
- Series :
- 2011
- Contact Material :
- Brass
- Connector Type :
- Header
- Contact Finish Thickness - Post :
- Flash
- Insulation Height :
- 0.098 (2.50mm)
- Number of Positions :
- 6
- Insulation Material :
- Polybutylene Terephthalate (PBT)
- Material Flammability Rating :
- UL94 V-0
- Mated Stacking Heights :
- -
- Voltage Rating :
- -
- Contact Length - Mating :
- 0.240 (6.10mm)
- Shrouding :
- Unshrouded
- Contact Finish - Post :
- Gold
- Fastening Type :
- Push-Pull
- Contact Type :
- Male Pin
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Datasheets
- 2011-2X03G00SD025B
2011 Series 2-Row Header Solder Brass Through Hole Gold Polybutylene Terephthalate (PBT) 6-Position Board to Board 0.098 (2.50mm) Height
2011-2X03G00SD025B Overview
It comes in Header packaging.The device's mounting type is Through Hole.It belongs to the 2011 Series of products.- is a possible application for the device.The device runs in -40°C ~ 105°C Operating Temperature.
2011-2X03G00SD025B Features
2011 series
2011-2X03G00SD025B Applications
There are a lot of Oupiin
2011-2X03G00SD025B Rectangular Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
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