2009890018
- Mfr.Part #
- 2009890018
- Manufacturer
- Molex
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 18POS 1.27MM
- Stock
- 31,303
- In Stock :
- 31,303
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- Manufacturer :
- Molex
- Product Category :
- Headers, Male Pins
- Contact Finish Thickness - Post :
- 78.7μin 2.00μm
- Contact Shape :
- Square
- Applications :
- Automotive, General Purpose, Telecommunications
- Style :
- Board to Board
- Packaging :
- Tube
- Series :
- Slim-Grid 200989
- Row Spacing - Mating :
- 0.050 (1.27mm)
- Insulation Color :
- Black
- Pbfree Code :
- yes
- Contact Finish Thickness - Mating :
- 2.00μin 0.051μm
- Pitch - Mating :
- 0.050 1.27mm
- Mounting Type :
- Surface Mount
- Insulation Material :
- Liquid Crystal Polymer (LCP), Glass Filled
- Connector Type :
- Header
- Contact Finish - Mating :
- Gold
- Termination :
- Solder
- Contact Type :
- Male Pin
- Voltage - Rated :
- 125V
- Contact Finish - Post :
- Tin
- Material Flammability Rating :
- UL94 V-0
- Operating Temperature :
- -55°C~105°C
- Number of Positions :
- 18
- Number of Rows :
- 2
- RoHS Status :
- ROHS3 Compliant
- Insulation Height :
- 0.280 7.10mm
- Contact Material :
- COPPER ALLOY
- Shrouding :
- Shrouded - 4 Wall
- Number of Positions Loaded :
- All
- Fastening Type :
- Latch Holder
- Datasheets
- 2009890018
Slim-Grid 200989 Series 2-Row Header Solder Copper Alloy Tube Surface Mount Gold Liquid Crystal Polymer (LCP), Glass Filled 18-Position Board to Board 0.280 7.10mm Height
2009890018 Overview
The packaging is Header.Mounting type is Surface Mount.To package the product, we use a Tube case.This product is from the Slim-Grid 200989 Series.A possible application is Automotive, General Purpose, Telecommunications.Device runs at -55°C~105°C Operating Temperature.
2009890018 Features
Slim-Grid 200989 series
2009890018 Applications
There are a lot of Molex
2009890018 Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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