10076801-407-06LF
- Mfr.Part #
- 10076801-407-06LF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 6POS 2.54MM
- Stock
- 6,169
- In Stock :
- 6,169
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- Headers, Male Pins
- Mounting Type :
- Through Hole
- Length :
- 7.62mm
- Contact Length - Post :
- 0.126 3.20mm
- Mount :
- Through Hole
- Number of Rows :
- 2
- Termination :
- Solder
- Body Breadth :
- 0.19 inch
- Max Voltage Rating (AC) :
- 1.5kV
- Contact Finish - Mating :
- Tin
- Number of Positions Loaded :
- All
- Orientation :
- Straight
- Insulation Height :
- 0.112 2.85mm
- Radiation Hardening :
- No
- Number of Conductors :
- ONE
- Reliability :
- COMMERCIAL
- Overall Contact Length :
- 0.651 16.53mm
- JESD-609 Code :
- e3
- Factory Lead Time :
- 8 Weeks
- Max Operating Temperature :
- 125°C
- Number Of PCB Rows :
- 2
- Contact Type :
- Male Pin
- PCB Contact Pattern :
- RECTANGULAR
- Number of Positions :
- 6
- RoHS Status :
- RoHS Compliant
- Fastening Type :
- Push-Pull
- Pitch - Mating :
- 0.100 2.54mm
- Housing Color :
- Black
- Series :
- BERGSTIK®
- Contact Shape :
- Square
- Insulation Material :
- Thermoplastic
- Mating Contact Pitch :
- 0.1 inch
- Material Flammability Rating :
- UL94 V-0
- Depth :
- 4.83mm
- Reference Standard :
- UL
- Contact Material :
- Phosphor Bronze
- Contact Finish Thickness - Mating :
- 78.7μin 2.00μm
- Style :
- Board to Board
- Contact Length - Mating :
- 0.413 10.50mm
- Connector Type :
- Header, Breakaway
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Min Operating Temperature :
- -65°C
- Plating Thickness :
- 78μin
- Contact Finish Thickness - Post :
- 78.7μin 2.00μm
- Packaging :
- Bulk
- Shrouding :
- Unshrouded
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Datasheets
- 10076801-407-06LF

BERGSTIK® Series 2-Row Header, Breakaway Solder Phosphor Bronze Bulk Through Hole Tin Thermoplastic 6-Position Board to Board 0.112 2.85mm Height
10076801-407-06LF Overview
Packaging is in the form of Header, Breakaway.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the BERGSTIK® Series.If the temperature is below 125°C, it's best to use it.-65°C is the minimum temperature for this device.There is a mounting hole at Through Hole.
10076801-407-06LF Features
BERGSTIK® series
10076801-407-06LF Applications
There are a lot of Amphenol ICC (FCI)
10076801-407-06LF Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















