0702473454

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Mfr.Part #
0702473454
Manufacturer
Molex
Package / Case
Datasheet
Download
Description
CGRID HDR SHRD RA OSTDF 13AULF 3
Stock
592
In Stock :
592

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Manufacturer :
Molex
Product Category :
Headers, Male Pins
Number of Rows :
2
Mounting Type :
Through Hole
Number of Positions Loaded :
All
Style :
Board to Cable/Wire
Contact Finish - Mating :
Gold
Current Rating (Amps) :
2.5A
Contact Type :
Female Socket
Material Flammability Rating :
UL94 V-0
Operating Temperature :
-55°C~120°C
Number of Positions :
34
Stack Height (Mating) :
5mm
Pitch - Mating :
0.100 2.54mm
Contact Shape :
Square
Applications :
GENERAL PURPOSE
Row Spacing - Mating :
0.100 (2.54mm)
Contact Finish Thickness - Mating :
5.00μin 0.127μm
Contact Finish Thickness - Post :
39.4μin 1.00μm
Insulation Material :
Polyester
Series :
C-Grid 70247
Contact Material :
Phosphor Bronze
Contact Length - Post :
0.100 2.54mm
Fastening Type :
Push-Pull
Connector Type :
Header
Voltage - Rated :
250V
Insulation Color :
Black
Termination :
Solder
Factory Lead Time :
10 Weeks
Datasheets
0702473454
Introducing Headers, Male Pins Molex 0702473454 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-55°C~120°C, 0702473454 pinout, 0702473454 datasheet PDF, 0702473454 amp .Beyond Headers, Male Pins Molex 0702473454 ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.

Molex 0702473454


C-Grid 70247 Series 2-Row Header Solder Phosphor Bronze Through Hole Gold Polyester 34-Position Board to Cable/Wire

0702473454 Overview


Packaging is Header.Through Hole is the mounting type.As a product of the C-Grid 70247 Series, it can be found in this category.A possible application of the device would be General Purpose.The device is operating at -55°C~120°C Operating Temperature.

0702473454 Features


C-Grid 70247 series


0702473454 Applications


There are a lot of Molex
0702473454 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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