XUF216-512-FB236-I20

Manufacturer :

XMOS

Product Category :

Microcontrollers

Operating Temperature :

-40°C~85°C TA

Supplier Device Package :

236-FBGA (10x10)

Interface :

USB

Program Memory Type :

Flash

Max Operating Temperature :

85°C

Mounting Type :

Surface Mount

RAM Size :

512K x 8

Core Architecture :

XCore

RoHS Status :

ROHS3 Compliant

Oscillator Type :

External

Package / Case :

236-LFBGA

Number of I/O :

104

Program Memory Size :

2MB 2M x 8

Memory Type :

Flash

Min Operating Temperature :

-40°C

Connectivity :

USB

Voltage - Supply (Vcc/Vdd) :

0.95V~3.6V

Speed :

2000MIPS

Number of Pins :

236

Core Processor :

XCore

Core Size :

32-Bit 16-Core

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

12 Weeks

Series :

XUF

Published :

2015

Packaging :

Tray

Memory Size :

2MB