XS170

- Mfr.Part #
- XS170
- Manufacturer
- Littelfuse
- Package / Case
- 8-SMD, Gull Wing
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 8DIP
- Stock
- 47,084





- In Stock :
- 47,084
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- Manufacturer :
- Littelfuse
- Product Category :
- Telecom
- Termination :
- Gull wing
- Mount :
- Surface Mount
- Number of Pins :
- 8
- Packaging :
- Tube
- Terminal Finish :
- Matte Tin (Sn)
- Published :
- 2001
- Min Operating Temperature :
- -40°C
- Height :
- 3.302mm
- RoHS Status :
- ROHS3 Compliant
- Package :
- Tube
- Configuration :
- SINGLE WITH OPTOCOUPLER AC INPUT-TRANSISTOR OUTPUT
- Minimum Operating Temperature :
- - 40 C
- Lead Free :
- Lead Free
- HTS Code :
- 8541.40.95.00
- Supplier Device Package :
- 8-SMD
- Power (Watts) :
- 800mW
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~85°C
- Pbfree Code :
- yes
- Isolation Voltage-Max :
- 3750 V
- Additional Feature :
- UL RECOGNIZED, HIGH RELIABILITY, CMOS COMPATIBLE
- Interface :
- -
- Reach Compliance Code :
- Unknown
- Number of Circuits :
- 2
- Maximum Operating Temperature :
- + 85 C
- Length :
- 9.652mm
- Output Type :
- MOSFET
- Current - Supply :
- -
- Function :
- Relay Switch
- Resistance :
- 50Ohm
- Voltage - Supply :
- -
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mounting Style :
- PCB Mount
- Input Current :
- 50mA
- Forward Current-Max :
- 0.05 A
- Width :
- 6.35mm
- JESD-609 Code :
- e3
- Max Power Dissipation :
- 800mW
- Optoelectronic Device Type :
- TRANSISTOR OUTPUT SSR
- Package / Case :
- 8-SMD, Gull Wing
- Base Product Number :
- XS170
- Series :
- -
- Number of Elements :
- 1
- Product Status :
- Active
- Output Voltage :
- 350V
- Factory Lead Time :
- 8 Weeks
- Throw Configuration :
- SPST
- Max Operating Temperature :
- 85°C
- Manufacturer :
- IXYS Integrated Circuits Division
- Datasheets
- XS170

Telecom Littelfuse XS170 Overview
The Telecom Littelfuse XS170 represents a pinnacle in interface technology specifically engineered for telecommunications applications. This integrated circuit is housed in a compact 8DIP (Dual Inline Package) format, designed to provide robust, high-performance interfacing solutions. As a crucial component in the telecom industry, the XS170 excels in reliability and versatility, making it an ideal choice for manufacturers looking to enhance system integrity and operational efficiency. The inclusion of advanced protective features ensures this IC withstands rigorous telecom environment demands, embodying the innovative engineering Littelfuse is known for.
XS170 Features
The XS170 boasts a range of features designed for superior telecom interfacing, including high voltage protection and low power consumption. Its compact 8DIP format facilitates easy integration into existing designs, minimizing the need for extensive redesigns. Enhanced signal integrity and noise reduction capabilities make the XS170 particularly suitable for high-fidelity and long-distance telecom applications.
XS170 Applications
- Telecommunication Systems: Integrates seamlessly into switching systems and PBXs to enhance signal clarity and reliability.
- VoIP Equipment: Ensures stable operation and improved sound quality in Voice over Internet Protocol technologies.
- Modems: Utilized in modems to facilitate efficient and reliable data transmission over telephone lines.
- Fax Machines: Improves transmission speed and reliability in facsimile machines, critical for business communications.
- Network Routers and Switches: Enhances connectivity and data flow management in network routers and switches for more stable internet and network services.
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