XL224-512-FB374-I40
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- Mfr.Part #
- XL224-512-FB374-I40
- Manufacturer
- XMOS
- Package / Case
- 374-LFBGA
- Datasheet
- Download
- Description
- IC MCU 32BIT ROMLESS 374FBGA
- Stock
- 9,470
- In Stock ：
- 9,470
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- Manufacturer :
- XMOS
- Product Category :
- Microcontrollers
- Number of I/O :
- 176
- Speed :
- 4000MIPS
- Operating Temperature :
- -40°C~85°C TA
- Supplier Device Package :
- 374-FBGA (18x18)
- Series :
- XL
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RAM Size :
- 512K x 8
- Memory Type :
- ROMless
- Core Architecture :
- XCore
- Core Size :
- 32-Bit 24-Core
- Min Operating Temperature :
- -40°C
- Max Operating Temperature :
- 85°C
- Package / Case :
- 374-LFBGA
- Oscillator Type :
- External
- Packaging :
- Tray
- Number of Pins :
- 374
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 12 Weeks
- Voltage - Supply (Vcc/Vdd) :
- 0.95V~3.6V
- Core Processor :
- XCore
- RoHS Status :
- ROHS3 Compliant
- Program Memory Type :
- ROMless
- Datasheets
- XL224-512-FB374-I40
Microcontrollers XMOS XL224-512-FB374-I40 Overview
The Microcontrollers XMOS XL224-512-FB374-I40 represents a cutting-edge solution in the world of embedded technology. Designed by XMOS, this IC MCU does not contain on-board ROM, allowing for flexible and customizable firmware updates and applications. The 32-bit architecture ensures robust performance and efficiency, suitable for demanding applications that require high-speed processing and multiple I/O options. Packaged in a 374-pin FBGA, it provides a compact footprint while offering ample connectivity options for complex digital systems. This product is ideal for developers looking for a versatile and powerful microcontroller unit that bridges the gap between traditional MCUs and high-performance computing platforms.
XL224-512-FB374-I40 Features
This MCU boasts a 32-bit processing unit, tailored for high-efficiency applications. The absence of built-in ROM enables greater flexibility in software development and deployment, ensuring that the system can be optimized and updated according to specific customer needs. The 374-pin FBGA package is designed for enhanced thermal management and reduced electromagnetic interference, making it a reliable choice for tightly packed electronic assemblies.
XL224-512-FB374-I40 Applications
- Industrial Automation: The robust processing capabilities and high I/O count make it ideal for controlling complex industrial machinery and production lines, enhancing efficiency and reliability.
- Consumer Electronics: Utilized in devices such as high-performance gaming consoles and smart home systems where rapid data processing and connectivity are crucial.
- Automotive Applications: Suitable for automotive electronics, including infotainment systems and advanced driver-assistance systems (ADAS), where durability and performance are essential.
- Audio Processing: Its high-speed signal processing abilities can be employed in digital audio platforms, synthesizers, and mixers, providing excellent audio quality and low latency.
- Communication Systems: Effective in communication infrastructure, supporting complex algorithms required for wireless communication and network protocols.
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| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| XL224-1024-FB374-C40 | XMOS | 10,404 | IC MCU 32BIT ROMLESS 374FBGA |
| XL224-1024-FB374-I40 | XMOS | 2,900 | IC MCU 32BIT ROMLESS 374FBGA |
| XL224-512-FB374-C40 | XMOS | 2,541 | IC MCU 32BIT ROMLESS 374FBGA |
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