XEF216-256-FB236-I20

Manufacturer :

XMOS

Product Category :

Microcontrollers

Connectivity :

RGMII, USB

RAM Size :

256K x 8

Core Size :

32-Bit 16-Core

Operating Temperature :

-40°C~85°C TA

Package / Case :

236-LFBGA

Program Memory Size :

2MB 2M x 8

Series :

XEF

Packaging :

Tray

Core Architecture :

XCore

Voltage - Supply (Vcc/Vdd) :

0.95V~3.6V

Core Processor :

XCore

Interface :

USB

Supplier Device Package :

236-FBGA (10x10)

Number of Pins :

236

Oscillator Type :

External

RoHS Status :

ROHS3 Compliant

Memory Type :

Flash

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Published :

2015

Number of I/O :

73

Memory Size :

2MB

Speed :

2000MIPS

Min Operating Temperature :

-40°C

Max Operating Temperature :

85°C

Mounting Type :

Surface Mount

Program Memory Type :

Flash