XE232-1024-FB374-C40

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Mfr.Part #
XE232-1024-FB374-C40
Manufacturer
XMOS
Package / Case
374-LFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 374FBGA
Stock
504
In Stock :
504

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Manufacturer :
XMOS
Product Category :
Microcontrollers
Package / Case :
374-LFBGA
RoHS Status :
ROHS3 Compliant
Speed :
4000MIPS
Packaging :
Tray
Interface :
USB
Number of Pins :
374
Core Size :
32-Bit 32-Core
Factory Lead Time :
12 Weeks
Mounting Type :
Surface Mount
Oscillator Type :
External
Series :
XE
REACH SVHC :
Unknown
Core Processor :
XCore
Number of I/O :
176
Voltage - Supply (Vcc/Vdd) :
0.95V~3.6V
Published :
2015
Connectivity :
RGMII, USB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~70°C TA
Lead Free :
Lead Free
RAM Size :
1M x 8
Program Memory Type :
ROMless
Introducing Microcontrollers XMOS XE232-1024-FB374-C40 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:374-LFBGA, Number of Pins:374, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, XE232-1024-FB374-C40 pinout, XE232-1024-FB374-C40 datasheet PDF, XE232-1024-FB374-C40 amp .Beyond Microcontrollers XMOS XE232-1024-FB374-C40 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

XMOS XE232-1024-FB374-C40


Microcontrollers XMOS XE232-1024-FB374-C40 Overview

The Microcontrollers XMOS XE232-1024-FB374-C40 is a state-of-the-art microcontroller unit (MCU) designed for sophisticated embedded applications. This product, engineered by XMOS, lacks an onboard ROM, allowing for flexible, external storage solutions according to user needs. The MCU is packaged in a 374-pin FBGA (Fine-Pitch Ball Grid Array), ensuring robust physical integration with a compact footprint. Ideal for high-performance computing tasks, it offers powerful 32-bit processing capabilities, making it perfect for demanding industrial, commercial, and technological applications.

XE232-1024-FB374-C40 Features

The XE232-1024-FB374-C40 MCU is noted for its exceptional performance and adaptability. Key features include a 32-bit architecture that supports high-speed processing and multitasking. The ROMless design permits greater customization in terms of memory management and application specificity. Additionally, its 374-pin FBGA packaging enhances reliability in harsh environments and minimizes space requirements on PCBs (Printed Circuit Boards).

XE232-1024-FB374-C40 Applications

  • Advanced Audio Systems: Utilizes its high-speed processing to handle complex audio processing algorithms, delivering enhanced audio experiences in professional audio equipment.
  • Industrial Automation: Empowers control systems for machinery and production lines, optimizing operations through its capable multitasking environment.
  • Consumer Electronics: Drives sophisticated functionalities in consumer devices such as smart home systems and high-performance gaming consoles, ensuring responsive user interactions and processing.
  • Automotive Applications: Supports advanced automotive technologies, including infotainment systems and driver assistance features, with its robust processing power and reliability in demanding conditions.
  • Internet of Things (IoT) Devices: Serves as the core processing unit in IoT devices, facilitating rapid data processing and connectivity, essential for smart devices and connected solutions.
This structured product description uses HTML tags for clear formatting and division into logical sections, catering to professional and technical audiences interested in the XE232-1024-FB374-C40 MCU by XMOS.
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