XCZU7EV-3FBVB900E

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Mfr.Part #
XCZU7EV-3FBVB900E
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
15,064
In Stock :
15,064

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Peripherals :
DMA, WDT
Series :
Zynq® UltraScale+™ MPSoC EV
Packaging :
Tray
Package / Case :
900-BBGA, FCBGA
Published :
2016
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of I/O :
204
Primary Attributes :
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
0°C~100°C TJ
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size :
256KB
RoHS Status :
ROHS3 Compliant
Speed :
600MHz, 1.5GHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
HTS Code :
8542.31.00.01
Architecture :
MCU, FPGA
Datasheets
XCZU7EV-3FBVB900E
Introducing System On Chip (SoC) AMD Xilinx XCZU7EV-3FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCZU7EV-3FBVB900E pinout, XCZU7EV-3FBVB900E datasheet PDF, XCZU7EV-3FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU7EV-3FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU7EV-3FBVB900E


0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC EV is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.204 I/Os are available in this SoC part.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU7EV-3FBVB900E System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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