XCZU5EV-L1FBVB900I
- Mfr.Part #
- XCZU5EV-L1FBVB900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 900FCBGA
- Stock
- 7,121
- In Stock :
- 7,121
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supply Voltage-Max (Vsup) :
- 0.742V
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Number of I/O :
- 204
- Architecture :
- MCU, FPGA
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Speed :
- 500MHz, 600MHz, 1.2GHz
- Peripherals :
- DMA, WDT
- RoHS Status :
- ROHS3 Compliant
- Number of Terminations :
- 900
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
- Supply Voltage-Min (Vsup) :
- 0.698V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2016
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage :
- 0.72V
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Package / Case :
- 900-BBGA, FCBGA
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- JESD-30 Code :
- R-PBGA-B900
- Operating Temperature :
- -40°C~100°C TJ
- Packaging :
- Tray
- RAM Size :
- 256KB
- Factory Lead Time :
- 11 Weeks
- HTS Code :
- 8542.31.00.01
- Series :
- Zynq® UltraScale+™ MPSoC EV
- Datasheets
- XCZU5EV-L1FBVB900I

900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EV series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 204 I/Os.Use a power supply with a voltage of 0.72V if possible.It is unsafe to operate the SoCs wireless at voltages above 0.742V.Power supplies of at least 0.698V are required.A system on a chip benefits from having 900 terminations.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.This SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5EV-L1FBVB900I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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