XCZU5EV-L1FBVB900I

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Mfr.Part #
XCZU5EV-L1FBVB900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
7,121
In Stock :
7,121

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Supply Voltage-Max (Vsup) :
0.742V
Terminal Position :
BOTTOM
Terminal Form :
Ball
Number of I/O :
204
Architecture :
MCU, FPGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed :
500MHz, 600MHz, 1.2GHz
Peripherals :
DMA, WDT
RoHS Status :
ROHS3 Compliant
Number of Terminations :
900
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes :
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Supply Voltage-Min (Vsup) :
0.698V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Published :
2016
Surface Mount :
yes
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage :
0.72V
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Package / Case :
900-BBGA, FCBGA
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-30 Code :
R-PBGA-B900
Operating Temperature :
-40°C~100°C TJ
Packaging :
Tray
RAM Size :
256KB
Factory Lead Time :
11 Weeks
HTS Code :
8542.31.00.01
Series :
Zynq® UltraScale+™ MPSoC EV
Introducing System On Chip (SoC) AMD Xilinx XCZU5EV-L1FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:900, Package / Case:900-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XCZU5EV-L1FBVB900I pinout, XCZU5EV-L1FBVB900I datasheet PDF, XCZU5EV-L1FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU5EV-L1FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU5EV-L1FBVB900I


900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EV series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 204 I/Os.Use a power supply with a voltage of 0.72V if possible.It is unsafe to operate the SoCs wireless at voltages above 0.742V.Power supplies of at least 0.698V are required.A system on a chip benefits from having 900 terminations.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.This SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU5EV-L1FBVB900I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
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