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    Mfr.Part #
    XCZU5EV-3FBVB900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    12,527
    In Stock ：
    12,527

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Packaging :
    Tray
    Operating Temperature :
    0°C~100°C TJ
    RAM Size :
    256KB
    Package / Case :
    900-BBGA, FCBGA
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Architecture :
    MCU, FPGA
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
    Speed :
    600MHz, 1.5GHz
    Number of I/O :
    204
    Series :
    Zynq® UltraScale+™ MPSoC EV
    Factory Lead Time :
    11 Weeks
    HTS Code :
    8542.31.00.01
    Published :
    2016
    Peripherals :
    DMA, WDT
    Datasheets
    XCZU5EV-3FBVB900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU5EV-3FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XCZU5EV-3FBVB900E pinout, XCZU5EV-3FBVB900E datasheet PDF, XCZU5EV-3FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU5EV-3FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU5EV-3FBVB900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EV series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU5EV-3FBVB900E System On Chip (SoC) applications.


    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
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