XCZU5CG-2FBVB900E

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Mfr.Part #
XCZU5CG-2FBVB900E
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
27,950
In Stock :
27,950

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
900-BBGA, FCBGA
Factory Lead Time :
11 Weeks
RoHS Status :
ROHS3 Compliant
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes :
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Series :
Zynq® UltraScale+™ MPSoC CG
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RAM Size :
256KB
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed :
533MHz, 1.3GHz
Number of I/O :
204
Peripherals :
DMA, WDT
Operating Temperature :
0°C~100°C TJ
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Architecture :
MCU, FPGA
Published :
2016
Pbfree Code :
yes
HTS Code :
8542.31.00.01
Datasheets
XCZU5CG-2FBVB900E
Introducing System On Chip (SoC) AMD Xilinx XCZU5CG-2FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCZU5CG-2FBVB900E pinout, XCZU5CG-2FBVB900E datasheet PDF, XCZU5CG-2FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU5CG-2FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU5CG-2FBVB900E


0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU5CG-2FBVB900E System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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