XCZU4EV-L2FBVB900E

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Mfr.Part #
XCZU4EV-L2FBVB900E
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
3,630
In Stock :
3,630

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
RAM Size :
256KB
Terminal Form :
Ball
Factory Lead Time :
11 Weeks
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Surface Mount :
yes
HTS Code :
8542.31.00.01
Packaging :
Tray
Published :
2016
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Series :
Zynq® UltraScale+™ MPSoC EV
Supply Voltage :
0.72V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage-Max (Vsup) :
0.742V
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
0°C~100°C TJ
Supply Voltage-Min (Vsup) :
0.698V
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Speed :
533MHz, 600MHz, 1.3GHz
Peripherals :
DMA, WDT
Primary Attributes :
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Package / Case :
900-BBGA, FCBGA
Number of I/O :
204
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Architecture :
MCU, FPGA
JESD-30 Code :
R-PBGA-B900
Number of Terminations :
900
RoHS Status :
ROHS3 Compliant
Introducing System On Chip (SoC) AMD Xilinx XCZU4EV-L2FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:900-BBGA, FCBGA, Number of Terminations:900, XCZU4EV-L2FBVB900E pinout, XCZU4EV-L2FBVB900E datasheet PDF, XCZU4EV-L2FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4EV-L2FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU4EV-L2FBVB900E


900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EV series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 204 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.It is really beneficial to have system on a chip since there are 900 terminations in total.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU4EV-L2FBVB900E System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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