XCZU4EV-L2FBVB900E
- Mfr.Part #
- XCZU4EV-L2FBVB900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 900FCBGA
- Stock
- 3,630
- In Stock :
- 3,630
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- RAM Size :
- 256KB
- Terminal Form :
- Ball
- Factory Lead Time :
- 11 Weeks
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Surface Mount :
- yes
- HTS Code :
- 8542.31.00.01
- Packaging :
- Tray
- Published :
- 2016
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Series :
- Zynq® UltraScale+™ MPSoC EV
- Supply Voltage :
- 0.72V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 0.742V
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Operating Temperature :
- 0°C~100°C TJ
- Supply Voltage-Min (Vsup) :
- 0.698V
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Speed :
- 533MHz, 600MHz, 1.3GHz
- Peripherals :
- DMA, WDT
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Package / Case :
- 900-BBGA, FCBGA
- Number of I/O :
- 204
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Architecture :
- MCU, FPGA
- JESD-30 Code :
- R-PBGA-B900
- Number of Terminations :
- 900
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XCZU4EV-L2FBVB900E

900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EV series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 204 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.It is really beneficial to have system on a chip since there are 900 terminations in total.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU4EV-L2FBVB900E System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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