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    Mfr.Part #
    XCZU4EG-3FBVB900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    492
    In Stock ：
    492

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    RAM Size :
    256KB
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Operating Temperature :
    0°C~100°C TJ
    Speed :
    600MHz, 1.5GHz
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Package / Case :
    900-BBGA, FCBGA
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Number of I/O :
    204
    Published :
    2016
    Packaging :
    Tray
    Peripherals :
    DMA, WDT
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    HTS Code :
    8542.31.00.01
    Architecture :
    MCU, FPGA
    Factory Lead Time :
    11 Weeks
    RoHS Status :
    ROHS3 Compliant
    Datasheets
    XCZU4EG-3FBVB900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU4EG-3FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XCZU4EG-3FBVB900E pinout, XCZU4EG-3FBVB900E datasheet PDF, XCZU4EG-3FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4EG-3FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4EG-3FBVB900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processors in this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 204 I/Os.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU4EG-3FBVB900E System On Chip (SoC) applications.


    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
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