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  6. XCZU46DR-2FFVH1760E
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    XCZU46DR-2FFVH1760E

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    Mfr.Part #
    XCZU46DR-2FFVH1760E
    Manufacturer
    AMD Xilinx
    Package / Case
    Radial
    Datasheet
    Download
    Description
    IC ZUP RFSOC A53 FPGA 1760BGA
    Stock
    32,400
    In Stock ：
    32,400

    Request A Quote(RFQ)

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    * Quantity:
    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Termination :
    PC Pins
    Number of I/O :
    574
    Peripherals :
    DDR, DMA, PCIe
    Package :
    Tray
    Ratings :
    --
    Flash Size :
    -
    Product Status :
    Active
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
    RAM Size :
    256KB
    Operating Temperature :
    -55°C ~ 105°C
    Voltage Rating - DC :
    250V
    Package / Case :
    Radial
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Size / Dimension :
    0.492 L x 0.173 W (12.50mm x 4.40mm)
    Speed :
    533MHz, 1.333GHz
    Features :
    Long Life
    Applications :
    GENERAL PURPOSE
    Moisture Sensitivity Level (MSL) :
    --
    Architecture :
    MCU, FPGA
    Tolerance :
    ±10%
    Supplier Device Package :
    1760-FCBGA (42.5x42.5)
    Mounting Type :
    Through Hole
    Dielectric Material :
    Polyester, Metallized
    Height - Seated (Max) :
    0.370 (9.40mm)
    Lead Spacing :
    0.394 (10.00mm)
    Capacitance :
    0.082µF
    Packaging :
    Bulk
    Series :
    MKT369
    Voltage Rating - AC :
    160V
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Introducing System On Chip (SoC) AMD Xilinx XCZU46DR-2FFVH1760E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-55°C ~ 105°C, Package / Case：Radial, Mounting Type：Through Hole, XCZU46DR-2FFVH1760E pinout, XCZU46DR-2FFVH1760E datasheet PDF, XCZU46DR-2FFVH1760E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU46DR-2FFVH1760E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU46DR-2FFVH1760E


    -55°C ~ 105°C System On Chip MKT369 Series 574 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package Radial is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series MKT369.This SoC meaning should have an average operating temperature of -55°C ~ 105°C.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 930K+ Logic Cells.A state-of-the-art Bulk package houses this SoC system on a chip.574 I/Os are included in this SoC part.A - flash can be seen on it.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    - extended flash.


    There are a lot of AMD


    XCZU46DR-2FFVH1760E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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