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  6. XCZU3EG-2SFVA625I
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    Mfr.Part #
    XCZU3EG-2SFVA625I
    Manufacturer
    AMD Xilinx
    Package / Case
    625-BFBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 625FCBGA
    Stock
    18,048
    In Stock ：
    18,048

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Factory Lead Time :
    11 Weeks
    Series :
    Zynq® UltraScale+™ MPSoC EG
    RAM Size :
    256KB
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Architecture :
    MCU, FPGA
    Speed :
    533MHz, 600MHz, 1.3GHz
    JESD-30 Code :
    R-PBGA-B625
    Terminal Position :
    BOTTOM
    Packaging :
    Tray
    Supply Voltage-Min (Vsup) :
    0.825V
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Published :
    2016
    Peripherals :
    DMA, WDT
    Supply Voltage :
    0.85V
    Supply Voltage-Max (Vsup) :
    0.876V
    Number of I/O :
    180
    RoHS Status :
    ROHS3 Compliant
    Package / Case :
    625-BFBGA, FCBGA
    Operating Temperature :
    -40°C~100°C TJ
    Terminal Form :
    Ball
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    Surface Mount :
    yes
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Number of Terminations :
    625
    HTS Code :
    8542.31.00.01
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Datasheets
    XCZU3EG-2SFVA625I
    Introducing System On Chip (SoC) AMD Xilinx XCZU3EG-2SFVA625I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：625-BFBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, Number of Terminations：625, XCZU3EG-2SFVA625I pinout, XCZU3EG-2SFVA625I datasheet PDF, XCZU3EG-2SFVA625I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3EG-2SFVA625I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU3EG-2SFVA625I


    625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 180 I/O 0.85V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.180 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.For the SoCs wireless, a voltage higher than 0.876V is considered unsafe.It can feed on a power supply of at least 0.825V.There are 625 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT


    There are a lot of Xilinx Inc.


    XCZU3EG-2SFVA625I System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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