XCVU23P-3VSVA1365E

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Mfr.Part #
XCVU23P-3VSVA1365E
Manufacturer
AMD Xilinx
Package / Case
1365-BFBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP 1365FCBGA
Stock
21,081
In Stock :
21,081

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Contact Finish Thickness :
8.00µin (0.203µm)
Number of Logic Elements/Cells :
2252250
Features :
Board Guide, Solder Retention
Contact Finish :
Gold
Voltage - Supply :
0.873V ~ 0.927V
Series :
Free Height (FH) GIGA
Number of LABs/CLBs :
128700
Product Status :
Active
Package / Case :
1365-BFBGA, FCBGA
Operating Temperature :
0°C ~ 100°C (TJ)
Mounting Type :
Surface Mount
Height Above Board :
0.128 (3.25mm)
Pitch :
0.024 (0.60mm)
Connector Type :
Receptacle, Center Strip Contacts
Mated Stacking Heights :
4mm
Package :
Tray
Number of Positions :
40
Packaging :
Tape and Reel (TR)
Number of I/O :
364
Number of Rows :
2
Total RAM Bits :
77909197
Supplier Device Package :
1365-FCBGA (35x35)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-3VSVA1365E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1365-BFBGA, FCBGA, Operating Temperature:0°C ~ 100°C (TJ), Mounting Type:Surface Mount, XCVU23P-3VSVA1365E pinout, XCVU23P-3VSVA1365E datasheet PDF, XCVU23P-3VSVA1365E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-3VSVA1365E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU23P-3VSVA1365E


FPGAs AMD Xilinx XCVU23P-3VSVA1365E Overview

Introducing the AMD Xilinx XCVU23P-3VSVA1365E, a cutting-edge FPGA from the renowned Virtex UltraScale+ product line. This high-performance FPGA is engineered to meet the stringent requirements of next-generation hardware acceleration and digital signal processing. With its robust 1365-pin FCBGA package, the XCVU23P-3VSVA1365E offers a versatile platform for developers looking to push the boundaries of technology in data centers, networking, and high-frequency trading applications. Its advanced feature set is designed to accelerate applications requiring immense computational power and high-speed data throughput, making it an essential component for innovative tech solutions.

XCVU23P-3VSVA1365E Features

The AMD Xilinx XCVU23P-3VSVA1365E FPGA boasts an array of features that make it an exceptional choice for complex digital processing. Key attributes include its extensive logic integration capabilities, high I/O bandwidth, and superior signal processing power. Additionally, the device supports advanced security protocols and power efficiency enhancements, ensuring reliable and sustained performance in demanding operational environments.

XCVU23P-3VSVA1365E Applications

  • Data Centers: The FPGA is utilized for hardware acceleration tasks in data centers, improving efficiency and processing times for large-scale data analysis and cloud computing operations.
  • Networking: This product is integral in developing high-speed network systems, including routers and switches, facilitating faster and more reliable data transmission across networks.
  • High-Frequency Trading: In financial markets, the XCVU23P-3VSVA1365E is used to process trades at unparalleled speeds, significantly reducing latency and increasing the efficiency of trading algorithms.
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