XCVU095-3FFVB1760E
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- Mfr.Part #
- XCVU095-3FFVB1760E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 702 I/O 1760FCBGA
- Stock
- 14,655
- In Stock ：
- 14,655
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B1760
- ECCN Code :
- 3A001.A.7.B
- Operating Temperature :
- 0°C~100°C TJ
- Number of Logic Elements/Cells :
- 1176000
- Factory Lead Time :
- 10 Weeks
- Total RAM Bits :
- 62259200
- Terminal Pitch :
- 1mm
- Package / Case :
- 1760-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Form :
- Ball
- Width :
- 42.5mm
- Surface Mount :
- yes
- Packaging :
- Bulk
- Number of CLBs :
- 768
- Published :
- 2012
- Series :
- Virtex® UltraScale™
- Number of LABs/CLBs :
- 67200
- Organization :
- 768 CLBS
- Voltage - Supply :
- 0.970V~1.030V
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 3.81mm
- Length :
- 42.5mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1V
- Number of I/O :
- 702
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XCVU095-3FFVB1760E
3.81mm mm FPGAs Virtex® UltraScale™ Series 1760-BBGA, FCBGA 1mm mm
XCVU095-3FFVB1760E Overview
This package is included in the 1760-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1V volts power it. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.970V~1.030V . An FPGA belonging to the Virtex® UltraScale™ series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. Using the Bulk layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 62259200 RAM bits in terms of its RAM si62259200e. An array of 67200 LABs/CLBs is built into the FPGA. CLBs are the building blocks of its architecture.
XCVU095-3FFVB1760E Features
702 I/Os
Up to 62259200 RAM bits
XCVU095-3FFVB1760E Applications
There are a lot of Xilinx Inc.
XCVU095-3FFVB1760E FPGAs applications.
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
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