XCVM1302-2MSEVSVD1760
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- Mfr.Part #
- XCVM1302-2MSEVSVD1760
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC VERSALPRIME ACAP FPGA 1760BGA
- Stock
- 28,899
- In Stock ：
- 28,899
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supplier Device Package :
- 1760-FCBGA (40x40)
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Product Status :
- Active
- Package / Case :
- 1760-BFBGA, FCBGA
- Core Processor :
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Primary Attributes :
- Versal™ Prime FPGA, 70k Logic Cells
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Package :
- Tray
- Architecture :
- MPU, FPGA
- Series :
- Versal™ Prime
- Number of I/O :
- 402
- Peripherals :
- DDR, DMA, PCIe
- Type :
- Adaptive Compute Acc
- Speed :
- 600MHz, 1.4GHz
- Flash Size :
- -
- RAM Size :
- -
- Datasheets
- XCVM1302-2MSEVSVD1760
0°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 402 I/O
This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ is used to build this SoC.Its package is 1760-BFBGA, FCBGA.A - RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the Versal™ Prime series.For this SoC meaning, the average operating temperature should be 0°C ~ 100°C (TJ).A key point to note is that this SoC security combines Versal™ Prime FPGA, 70k Logic Cells.Total I/Os on this SoC part are 402.There is a flash of -.
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.
- RAM.
Built on MPU, FPGA.
- extended flash.
There are a lot of AMD
XCVM1302-2MSEVSVD1760 System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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