XCVM1302-2MSENBVB1024
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- Mfr.Part #
- XCVM1302-2MSENBVB1024
- Manufacturer
- AMD Xilinx
- Package / Case
- 5 mm x 3.2 mm
- Datasheet
- Download
- Description
- IC VERSALPRIME ACAP FPGA 1024BGA
- Stock
- 38,590
- In Stock ：
- 38,590
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Load Capacitance :
- 15 pF
- RoHS :
- Details
- Flash Size :
- -
- Mounting Style :
- SMD/SMT
- Frequency Stability :
- 50 PPM
- Number of I/O :
- 316
- Package :
- Tray
- Subcategory :
- Oscillators
- Peripherals :
- DDR, DMA, PCIe
- Output Format :
- HCMOS, TTL
- Frequency :
- 75 MHz
- Architecture :
- MPU, FPGA
- Brand :
- CTS Electronic Components
- Termination Style :
- SMD/SMT
- Height :
- 1.3 mm
- Series :
- 636
- Manufacturer :
- CTS
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes :
- Versal™ Prime FPGA, 70k Logic Cells
- Product Type :
- Standard Oscillators
- Operating Supply Voltage :
- 800 mV
- Core Processor :
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- RAM Size :
- -
- Length :
- 5 mm
- Speed :
- 600MHz, 1.4GHz
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 40 C
- Product Category :
- Standard Clock Oscillators
- Width :
- 3.2 mm
- Supplier Device Package :
- 1024-BGA (31x31)
- Product Status :
- Active
- Package / Case :
- 5 mm x 3.2 mm
- Packaging :
- Reel
- Datasheets
- XCVM1302-2MSENBVB1024
0°C ~ 100°C (TJ) System On Chip 636 Series 316 I/O
This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processors in this SoC.This system on a chip is packaged as 5 mm x 3.2 mm by the manufacturer.As this SoC chip has - RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MPU, FPGA method.The 636 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C ~ 100°C (TJ) on average.There is one thing to note about this SoC security: it combines Versal™ Prime FPGA, 70k Logic Cells.In the state-of-the-art Reel package, this SoC system on a chip is housed.This SoC part has a total of 316 I/Os.As any high-quality Oscillators, it is a system on a chip of outstanding capabilities.The flash is set to -.There is 75 MHz frequency associated with the wireless SoC.
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.
- RAM.
Built on MPU, FPGA.
- extended flash.
There are a lot of Xilinx
XCVM1302-2MSENBVB1024 System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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