XCVM1302-2LLENBVB1024

Manufacturer :

AMD Xilinx

Product Category :

System On Chip (SoC)

Product Type :

System-On-Modules - SOM

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed :

450MHz, 1.08GHz

Shielding :

Shielded

Subcategory :

SOC - Systems on a Chip

Product Category :

SoC FPGA

Minimum Operating Temperature :

0 C

Core Processor :

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Series :

Versal™ Prime

Flash Size :

-

Primary Attributes :

Versal™ Prime FPGA, 70k Logic Cells

Architecture :

MPU, FPGA

Number of I/O :

316

Operating Temperature :

0°C ~ 100°C (TJ)

Wire/Cable Type :

Data

Brand :

Xilinx

Product Status :

Active

Package :

Tray

Package / Case :

1024-BFBGA

Maximum Operating Temperature :

+ 110 C

Manufacturer :

Xilinx

Operating Supply Voltage :

700 mV

RoHS :

Compliant

RAM Size :

-

Peripherals :

DDR, DMA, PCIe

Mount :

CABLE

Supplier Device Package :

1024-BGA (31x31)